PIC18F6390 Datasheet, PDF (393/412 Pages) Microchip Technology – 64/80-Pin Flash Microcontrollers with LCD Driver and nanoWatt Technology

PIC18F6390/6490/8390/8490
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1 D
2
B
1
n
CH x 45°
A
α
c
β
φ
L
A1
(F)
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
Number of Pins
Pitch
n
80
p
.020
80
0.50
Pins per Side
n1
20
20
Overall Height
A
.039
.043
.047
1.00
1.10
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
Standoff
A1
.002
.004
.006
0.05
0.10
Foot Length
L
.018
.024
.030
0.45
0.60
Footprint (Reference)
(F)
.039
1.00
Foot Angle
φ
0
3.5
7
0
3.5
Overall Width
E
.541
.551
.561
13.75
14.00
Overall Length
D
.541
.551
.561
13.75
14.00
Molded Package Width
E1
.463
.472
.482
11.75
12.00
Molded Package Length
D1
.463
.472
.482
11.75
12.00
Lead Thickness
c
.004
.006
.008
0.09
0.15
Lead Width
B
.007
.009
.011
0.17
0.22
Pin 1 Corner Chamfer
Mold Draft Angle Top
CH
.025
.035
.045
0.64
0.89
α
5
10
15
5
10
Mold Draft Angle Bottom
β
5
10
15
5
10
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
A2
MAX
1.20
1.05
0.15
0.75
7
14.25
14.25
12.25
12.25
0.20
0.27
1.14
15
15
JEDEC Equivalent: MS-026
Drawing No. C04-092
 2004 Microchip Technology Inc.
Preliminary
DS39629B-page 391