PIC18F6390 Datasheet, PDF (392/412 Pages) Microchip Technology – 64/80-Pin Flash Microcontrollers with LCD Driver and nanoWatt Technology

PIC18F6390/6490/8390/8490
28.2 Package Details
The following sections give the technical details of the
packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1 D
2
1
B
n
CH x 45°
α
A
c
L
φ
A2
β
A1
(F)
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
Number of Pins
Pitch
n
64
p
.020
64
0.50
Pins per Side
n1
16
16
Overall Height
A
.039
.043
.047
1.00
1.10
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
Standoff
A1
.002
.006
.010
0.05
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
Footprint (Reference)
Foot Angle
(F)
.039
1.00
φ
0
3.5
7
0
3.5
Overall Width
E
.463
.472
.482
11.75
12.00
Overall Length
D
.463
.472
.482
11.75
12.00
Molded Package Width
E1
.390
.394
.398
9.90
10.00
Molded Package Length
D1
.390
.394
.398
9.90
10.00
Lead Thickness
c
.005
.007
.009
0.13
0.18
Lead Width
B
.007
.009
.011
0.17
0.22
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
CH
.025
.035
.045
0.64
0.89
α
5
10
15
5
10
β
5
10
15
5
10
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
MAX
1.20
1.05
0.25
0.75
7
12.25
12.25
10.10
10.10
0.23
0.27
1.14
15
15
JEDEC Equivalent: MS-026
Drawing No. C04-085
DS39629B-page 390
Preliminary
 2004 Microchip Technology Inc.