I347-AT4 Datasheet, PDF (9/148 Pages) Intel Corporation – Intel® Ethernet Network Connection I347-AT4 Datasheet

Contents — I347-AT4
4.1.45 Cable Tester Sample Point Distance - Page 5, Register 24 .................. 95
4.1.46 Cable Tester Cross Pair Positive Threshold - Page 5, Register 25 ....... 95
4.1.47 Cable Tester Same Pair
Impedance Positive Threshold 0 and 1 - Page 5, Register 26 ............... 95
4.1.48 Cable Tester Same Pair
Impedance Positive Threshold 2 and 3 - Page 5, Register 27 ............... 96
4.1.49 Cable Tester Same Pair Impedance Positive
Threshold 4 and Transmit Pulse Control - Page 5, Register 28 ............. 96
4.1.50 Packet Generation - Page 6, Register 16............................................... 97
4.1.51 CRC Counters - Page 6, Register 17 ..................................................... 97
4.1.52 Checker Control - Page 6, Register 18 .................................................. 97
4.1.53 General Control Register - Page 6, Register 20..................................... 98
4.1.54 Late Collision Counters 1 & 2 - Page 6, Register 23.............................. 98
4.1.55 Late Collision Counters 3 & 4 - Page 6, Register 24.............................. 99
4.1.56 Late Collision Window Adjust/Link Disconnect - Page 6, Register 25.... 99
4.1.57 Misc Test - Page 6, Register 26 ............................................................. 99
5.0
Electrical and Timing Specifications...............................................................................102
5.1 Recommended Operating Conditions ...............................................................102
5.2 Current Consumption ........................................................................................103
5.3 DC Operating Conditions ..................................................................................104
5.3.1 Digital Pins ...........................................................................................104
5.3.2 IEEE DC Transceiver Parameters........................................................105
5.3.3 SGMII Interface ....................................................................................105
5.4 AC Electrical Specifications...............................................................................110
5.4.1 Reset Timing ........................................................................................110
5.4.2 XTAL_IN/XTAL_OUT (CLK_SEL[1:0] = 10b or 11b) Timing ................111
5.4.3 LED to CONFIG Timing........................................................................111
5.4.4 Serial LED Timing ................................................................................112
5.5 SGMII Interface Timing .....................................................................................113
5.5.1 SGMII Output AC Characteristics.........................................................113
5.5.2 SGMII Input AC Characteristics ...........................................................113
5.6 MDC/MDIO Timing ............................................................................................114
5.7 JTAG Timing .....................................................................................................115
5.8 IEEE AC Transceiver Parameters.....................................................................115
5.9 Latency Timing ..................................................................................................116
5.9.1 10/100/1000BASE-T to SGMII Latency Timing....................................116
5.9.2 SGMII to 10/100/1000BASE-T Latency Timing....................................117
5.10 Crystal Specifications ........................................................................................120
6.0
Package .........................................................................................................................122
6.1 196-Pin TFBGA Package ..................................................................................123
7.0
Thermal Design Recommendations ...............................................................................125
7.1 Introduction........................................................................................................125
7.2 Intended Audience ............................................................................................125
7.3 Thermal Considerations ....................................................................................125
7.4 Thermal Management Importance ....................................................................126
7.5 Terminology and Definitions..............................................................................126
7.6 Package Thermal/Mechanical Specifications and Limits ..................................127
7.6.1 Thermal Limits - Max Junction/Case ....................................................127
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