I347-AT4 Datasheet, PDF (143/148 Pages) Intel Corporation – Intel® Ethernet Network Connection I347-AT4 Datasheet

Thermal Design Recommendations — I347-AT4
Figure 7.5. Thermal Impedance vs. Interfacial Pressure
Note:
Caution should be taken so that the maximum normal force as explained in Section 7.6.3 is
never exceeded.
7.7.2.2
PCM45 Series TIM
The recommended thermal interface material is the PCM45 Series from Honeywell*. The PCM45 Series
thermal interface pads are phase change materials formulated for use in high performance devices
requiring minimum thermal resistance for maximum heat sink performance and component reliability.
These pads consist of an electrically non-conductive, dry film that softens at device operating
temperatures resulting in a greasy-like performance. However, Intel has not fully validated the PCM45
Series TIM.
If adequate thermal margin exists, cheaper TIM with less performance can be used, especially for low
power applications. The selected material should be fully evaluated for long term reliability issues such
as dry-out and pump-out (if applicable). Double-sided PSAs should also be carefully evaluated to
ensure they provide robust, long term reliability and will not lose their adhesion.
Other TIM vendors to consider are Laird*, Chromerics*, and 3M*.
7.7.3
Attaching the Extruded Heat Sink
There are several different ways of attaching the heat sink to the component such as sheet metal clips,
wire gates, PSAs, or spring loaded push pins. Each of these solutions has their own pros and cons. For
detailed attaching methods, please contact the heat sink manufacturer. A well designed clip, wire gate,
or spring loaded push pin can offer a high level of reliability and rework-ability.
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