I347-AT4 Datasheet, PDF (139/148 Pages) Intel Corporation – Intel® Ethernet Network Connection I347-AT4 Datasheet

Thermal Design Recommendations — I347-AT4
7.6.4
Mechanical Specifications
The I347-AT4 is packaged in a 15 x 15 mm TFBGA as shown in Figure 7.1.
Figure 7.1. I347-AT4 TFBGA Mechanical Drawing
7.7
Thermal Solutions
One method frequently used to improve thermal performance is to attach a metallic heat sink to the top
of the device. The heat sink increases the surface area exposed to the ambient air promoting higher
rates of heat transfer. This in turn reduces the thermal resistance from the device junction to the air
(Θ_JA). In order to be effective, heat sinks should have a pocket of air around them that is free of
obstructions. This enables air to more easily flow through the fins of the heat sink, further increasing its
effectiveness.
Good system airflow is critical to dissipate the highest possible thermal power. The size and number of
fans, vents, and ducts, as well as their placement in relation to components and airflow channels within
the system determine the airflow path and volumetric flow rates throughout the system. Note that
acoustic noise constraints might limit the size and types of fans, vents, and ducts that can be used in a
particular design.
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