I347-AT4 Datasheet, PDF (145/148 Pages) Intel Corporation – Intel® Ethernet Network Connection I347-AT4 Datasheet

Thermal Design Recommendations — I347-AT4
7.9.3
Simulation Results
Table 4 shows the T_case as a function of airflow and ambient temperature with the component operating
at the TDP in the environment previously listed. This table can be used as an aid in determining a
starting point for the optimum airflow and heat sink combination for the I347-AT4.
Again, your system design might vary considerably from the environment used to generate these
values.
Note:
Thermal models are available upon request (Flotherm*: Detailed Model). Contact your local
Intel sales representative for I347-AT4 thermal models.
Table 7.4. Thermal Simulation Results for Various Environmental Conditions @ 3 W TDP
Airflow (LFM)
T_C
45
50
55
60
65
70
75
80
85
0
143.9
148.6
153.1
157.7
162.3
166.9
171.5
176.1
180.7
50
139.1
143.9
148.6
153.4
158.3
163.1
167.9
172.7
177.5
Note: No heat sink.
100
136.4
141.3
146.1
150.9
155.8
160.6
165.5
170.3
175.2
150
134.8
139.6
144.5
149.4
154.2
159.1
164
168.8
173.7
200
133.5
138.3
143.2
148.1
153
157.9
162.8
167.7
172.6
250
132.4
137.3
142.3
147.2
152.1
157
161.9
166.8
171.7
300
131.7
136.6
141.5
146.4
151.3
156.3
161.2
166.1
171.1
350
130.9
135.8
140.7
145.6
150.5
155.5
160.4
165.4
170.3
400
130.1
135.1
140
145
149.9
154.8
159.8
164.7
169.6
Airflow (LFM)
T_C
45
50
55
60
65
70
75
80
85
0
94.96
99.25
103.8
108.4
112.9
117.5
122.1
126.7
131.3
50
88.46
93.19
97.95
102.7
107.5
112.3
117.1
122.1
126.7
100
84.77
88.63
92.96
97.76
102.6
107.4
112.3
117.1
122
150
81.01
85.23
89.82
94.54
99.33
104.1
108.9
113.8
118.6
200
78.06
82.54
87.41
92.23
97.16
102
106.8
111.8
116.7
250
75.55
80.47
85.4
90.32
95.24
100.2
105.1
110
114.9
300
73.62
78.57
83.51
88.45
93.39
98.32
103.3
108.2
113.1
350
72.06
77.01
81.96
86.91
91.86
96.81
101.8
106.7
111.7
400
70.88
75.83
80.54
85.67
90.62
95.58
100.5
105.5
110.4
Note: 19 x 19 x 6.3 mm Alpha Novatech HS in Figure 7.2.
135