I347-AT4 Datasheet, PDF (135/148 Pages) Intel Corporation – Intel® Ethernet Network Connection I347-AT4 Datasheet

Thermal Design Recommendations — I347-AT4
7.0
Thermal Design Recommendations
7.1
Introduction
This section can be used as an aid to designing a thermal solution for systems implementing the I347-
AT4 product line. It details the maximum allowable operating junction and case temperatures and
provides the methodology necessary to measure these values. It also outlines the results of thermal
simulations of the I347-AT4 in a standard JEDEC test environment with a 2s2p board using various
thermal solutions.
7.2
Intended Audience
The intended audience for this section is system design engineers using the I347-AT4. System
designers are required to address component and system-level thermal challenges as the market
continues to adopt products with higher speeds and port densities. New designs might be required to
provide more effective cooling solutions for silicon devices depending on the type of system and target
operating environment.
7.3
Thermal Considerations
In a system environment, the temperature of a component is a function of both the system and
component thermal characteristics. System-level thermal constraints consist of the local ambient
temperature at the component, the airflow over the component and surrounding board, and the
physical constraints at, above, and surrounding the component that might limit the size of a thermal
solution.
The component's case and die temperature are the result of:
• Component power dissipation
• Component size
• Component packaging materials
• Type of interconnection to the substrate and motherboard
• Presence of a thermal cooling solution
• Power density of the substrate, nearby components, and motherboard
All of these parameters are pushed by the continued trend of technology to increase performance levels
(higher operating speeds, MHz) and power density (more transistors). As operating frequencies
increase and package size decreases, the power density increases and the thermal cooling solution
space and airflow become more constrained. The result is an increased emphasis on optimizing system
design to ensure that thermal design requirements are met for each component in the system.
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