I347-AT4 Datasheet, PDF (138/148 Pages) Intel Corporation – Intel® Ethernet Network Connection I347-AT4 Datasheet

I347-AT4 — Thermal Design Recommendations
7.6.2
Thermal Specifications
Table 7.2 lists the package-specific parameters under different conditions and environments. The
values Θ_JA and Ψ_JT should be used as references only as they can vary by system environments and
thermal solutions. Unless otherwise noted, the simulations were run in a JEDEC environment with a
four layer (2s2p), 76.2 mm x 114.3 mm board with no heat sink.
Table 7.2. Package Thermal Characteristics in Standard JEDEC Environment for Reference
Parameter
Θ_JA
Ψ_JT
Equation
P = TDP
P = TDP
Conditions
No Airflow
1 m/s
2 m/s
3 m/s
No Airflow
1 m/s
2 m/s
3 m/s
No Heat Sink
(°C/W)
31
28.3
27
25.9
0.75
0.87
0.96
1.03
Heat Sink 1
(°C/W)¹
22
16.4
14
-
5.3
5.4
5.5
-
Heat Sink 2
(°C/W)²
19.2
14
12.1
-
5.4
5.6
5.63
-
Θ_JC
No Airflow
7.9
P_top = Power through top
of package
-
-
Θ_JB
No Airflow
23.5
-
-
P_bot = Power through
bottom of package
1. 101.5 mm x 114.5 mm, 2s2p JEDEC board using 19 x 19 x 6.3 mm Alpha Novatech* heat sink as shown in Figure 7.2.
2. 101.5 mm x 114. 5mm, 2s2p JEDEC board using 27 x 27 x 10 mm Thermalloy* heat sink as shown in Figure 7.3.
7.6.3
Mechanical Limits - Maximum Static Normal Load
The I347-AT4 package is capable of sustaining a maximum static normal load of 8 lbf (35.6 N). This
load is an evenly distributed, uniform, compressive load in a direction perpendicular to the top surface
of the package. This limit must not be exceeded during heat sink installation, mechanical stress testing,
standard shipping conditions, and/or any other use condition. The load put on the package by the heat
sink attachment method should also not exceed this value. The PCB under the package must be fully
supported during heat sink installation to prevent any deformation of the PCB. This load specification is
based on limited testing for design characterization, and is for the package only.
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