I347-AT4 Datasheet, PDF (137/148 Pages) Intel Corporation – Intel® Ethernet Network Connection I347-AT4 Datasheet

Thermal Design Recommendations — I347-AT4
7.6
Package Thermal/Mechanical Specifications and Limits
7.6.1
Thermal Limits - Max Junction/Case
To ensure proper operation of the I347-AT4, the thermal solution must dissipate the heat generated by
the component and maintain a case temperature at or below the values listed in Table 7.1. Table 7.2
lists the thermal performance parameters per JEDEC JESD51-2 standard.
The I347-AT4 is designed to operate properly as long as the T_case rating is not exceeded. Section 7.10.1
describes the proper guidelines for measuring the case temperature.
Table 7.1. Absolute Maximum Junction/Case Temperature
Application
Measured TDP (W)
T_case-max (°C)¹
I347-AT4
3.0 W @ 125 °C T_j-max
108.11
1. Max T_case is based on 27 x 27 x 10 mm Thermalloy heat sink as shown in Figure 7.3.
The thermal limits previously defined are based on simulated results of the package assembled on a
standard multi-layer, 2s2p board with 1 oz internal planes and 2 oz external trace layers in a forced
convection environment. The maximum case temperature is based on the maximum junction
temperature and defined by the relationship, T_case-max = T_j-max – (Ψ_JT * P_TDP) where Ψ_JT is the
junction-to-top (of package) thermal characterization parameter. If the case temperature exceeds the
specified T_case-max, thermal enhancements such as heat sinks or forced air are required.
Analysis indicates that real applications are unlikely to cause the I347-AT4 to be at T_case-max for
sustained periods of time, given a properly designed thermal solution. Sustained operation at T_case-max
might affect long-term reliability of the I347-AT4 and the system and thus should be avoided.
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