I347-AT4 Datasheet, PDF (144/148 Pages) Intel Corporation – Intel® Ethernet Network Connection I347-AT4 Datasheet

I347-AT4 — Thermal Design Recommendations
7.8
Reliability
Each PCA, system, heat sink, and TIM combination varies in attach strength, long-term adhesive
performance, and TIM reliability. Carefully evaluate the reliability of the completed assembly prior to
high-volume use. Some reliability recommendations are listed in Table 7.3.
Table 7.3. Reliability Validation
Test
Mechanical Shock
Random Vibration
High Temperature Life
Thermal Cycling
Humidity
Requirement
50 G trapezoidal, board level
11 ms, 3 shocks/axis
7.3 G, board level
45 minutes/axis, 50 to 2000 Hz
85 °C
2000 hours total
Checkpoints occur at 168, 500, 1000, and 2000 hours
Per-Target Environment
(for example: -40 °C to +85 °C)
500 cycles
85% relative humidity
85 °C, 1000 hours
Pass/Fail Criteria
Visual and electrical check.
Visual and electrical check.
Visual and mechanical/electrical check.
Visual and mechanical/electrical check.
Visual and mechanical/electrical check.
7.9
JEDEC Simulation Results
7.9.1
Designing for Thermal Performance
Section 7.12 and Section 7.13 describe the PCB and system design recommendations that can aid in
achieving the I347-AT4 thermal performance documented in this section.
7.9.2
Simulation Setup
A simulation environment conforming to the JEDEC JESD51-2 standard was developed using a
101.5 mm x 114.5 mm, 2s2p board according to JEDEC JESD 51-9. Simulations were run with different
combinations of ambient temperature and airflow speed for three different thermal solution scenarios
as follows:
• No heat sink
• 19 mm x 19mm x 6.3 mm heat sink (Figure 7.2)
• 27 mm x 27 mm x 10 m heat sink (Figure 7.3)
Note: Keep the following in mind when reviewing the data that is included in this section:
• All data is preliminary and is not validated against physical samples.
• Your system design might be significantly different.
• A larger board with more than four copper layers might improve I347-AT4 thermal performance.
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