I347-AT4 Datasheet, PDF (148/148 Pages) Intel Corporation – Intel® Ethernet Network Connection I347-AT4 Datasheet

I347-AT4 — Thermal Design Recommendations
7.11
Conclusion
Increasingly complex systems require more robust and well thought out thermal solutions. The use of
system air, ducting, passive or active heat sinks, or any combination thereof can help lead to a low cost
solution that meets your environmental constraints.
The simplest and most cost-effective method is to improve the inherent system cooling characteristics
through careful design and placement of fans, vents, and ducts. When additional cooling is required,
thermal enhancements can be implemented in conjunction with enhanced system cooling. The size of
the fan or heat sink can be varied to balance size and space constraints with acoustic noise.
Use the data and methodologies in this section as a starting point to designing and validating a thermal
solution for the I347-AT4. By maintaining the I347-AT4 case temperature below those recommended in
this section, the I347-AT4 functions properly and reliably.
7.12
Table 7.5.
Heat Sink and Attach Suppliers
Heat Sink and Attach Suppliers
Part
Alpha Heat Sinks
Aavid-Thermalloy Heat Sink
PCM45 Series
Part Number
LPD40-10B
LPD25-7B
Z19-6.3B
374324B60023G
PCM45F
Supplier
Contact
Alpha Novatech, Inc
Aavid Thermalloy
Honeywell
Sales
Aplha Novatech, Inc.
408-567-8082
[e-mail]
Harish Rutti
67 Primrose Dr.
Suite 200
Laconia, NH 03246
Business: 972-633-9371 x27
North America Technical Contact: Paula Knoll
1349 Moffett Park Dr.
Sunnyvale, CA 94089
Cell: 1-858-705-1274
Business: 858-279-2956
[e-mail]
7.13
PCB Layout Guidelines
The following general PCB design guidelines are recommended to maximize the thermal performance of
TFBGA packages:
• When connecting ground (thermal) vias to the ground planes, do not use thermal-relief patterns.
• Thermal-relief patterns are designed to limit heat transfer between the vias and the copper planes,
thus constricting the heat flow path from the component to the ground planes in the PCB.
• As board temperature also has an effect on the thermal performance of the package, avoid placing
the I347-AT4 adjacent to high-power dissipation devices.
• If airflow exists, locate the components in the mainstream of the airflow path for maximum thermal
performance. Avoid placing the components downstream, behind larger devices or devices with
heat sinks that obstruct or significantly preheat the air flow.
Note:
This information is provided as a general guideline to help maximize the thermal performance
of the components.
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