82845PE Datasheet, PDF (144/176 Pages) Intel Corporation – 82845GE Graphics and Memory Controller Hub (GMCH) and 82845PE Memory Controller Hub (MCH)

Electrical Characteristics
6.3
Power Characteristics
Table 6-3. Power Characteristics
Symbol
P_GMCH
I_VCC
I_VCCAGP
I_VCCAGP
I_VCCHI
I_VTTFSB
I_VCCSM
I_{SUS_2.5}
Parameter
(G)MCH Thermal Design Power
1.5 V Core Supply Current
1.5 V AGP Supply Current (AGP mode)
1.5 V AGP Supply Current (DVO mode)
1.5 V Hub Interface Supply Current
(G)MCH VTT supply Current
DDR System Memory Interface (2.5 V) Supply Current
2.5 V Standby Supply Current
Max
2.93
0.37
0.18
90
2.4
2.6
200
Unit
W
A
A
A
mA
A
A
mA
NOTES:
1. See Intel^® 845GE/845PE Chipset Thermal Design Guide for more information.
2. These current levels may happen simultaneously and can be summed into one supply.
Notes
1
2
2
2
2
6.4
Signal Groups
The signal description includes the type of buffer used for the particular signal (see Table 6-4):
AGTL+
AGP
HI CMOS
DDR CMOS
Open Drain AGTL+ interface signal. Refer to the AGTL+ I/O Specification
for complete details. The (G)MCH integrates most AGTL+ termination
resistors.
AGP interface signals. These signals are compatible with AGP 2.0 1.5 V
Signaling Environment DC and AC Specifications. The buffers are not 3.3 V
tolerant. (DVO signals use the same buffers as AGP)
Hub Interface 1.5 V CMOS buffers.
DDR System memory 2.5 V CMOS buffers.
Table 6-4. Signal Groups (Sheet 1 of 2)
Signal
Group
Signal Type
Signals
AGP Interface Signal Groups
(a)
AGP I/O
(b)
AGP Input
(c)
AGP Output
(d)
AGP Miscellaneous
Hub Interface Signal Groups
(e)
Hub Interface
CMOS I/O
(f)
Hub Interface
Miscellaneous
GADSTB_[1:0], GADSTB_[1:0]#, GFRAME#, GIRDY#, GTRDY#,
GSTOP#, GDEVSEL#, GAD_[31:0], GC/BE_[3:0]#, GPAR
GPIPE#, GSBA_[7:0], GRBF#, GWBF#, GSBSTB, GSBSTB#, GREQ#
GST_[2:0], GGNT#
AGP_VREF, AGP_RCOMP
HI_[10:0], HISTBS, HISTBF
HI_SWING, HI_VREF, HI_RCOMP
144
Intel^® 82845GE/82845PE Datasheet