HY5FS123235AFCP Datasheet, PDF (72/74 Pages) Hynix Semiconductor – 512M (16Mx32) GDDR4 SDRAM

Package Dimensions
Figure 45: XY Dim ensions
14
16 x 0.8=12.8
0.8
HY5FS123235AFCP
11
B 2)
2)
A
1) 3)
1) Bad Unit Marking (BUM) - position and shape prelim inary
2) Middle of Package
3) Package Orientation Mark A 1
Figure 46: Package Height
Table 29 Package Height Parameter
hpackage
stand-off
nominal
1.100 mm
0.350 mm
variation
+/- 0.100 mm
+/- 0.050mm
Note
1) The GDDR4 package height specification is compliant to MO-207, DR-2 applying Note 22.
Rev. 1.2 /June. 2008
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