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MC908KX2MDWE Datasheet, PDF (205/210 Pages) Freescale Semiconductor, Inc – High-performance M68HC08 architecture, Fully upward-compatible object code with M6805, M146805, and M68HC05 Families | |||
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B.4.6 Internal Oscillator Characteristics
Electrical Specifications
Characteristic(1)
Symbol
Min
Typ
Max
Unit
Internal oscillator base frequency(2), (3)
fINTOSC
230.4
320
384
kHz
Internal oscillator tolerance
fOSC_TOL
â25
â
+25
%
Internal oscillator multiplier(4)
N
1
â
127
â
1. VDD = 5.5 Vdc to 2.7 Vdc, VSS = 0 Vdc, TA = â40°C to +85°C, unless otherwise noted
2. Internal oscillator is selectable through software for a maximum frequency. Actual frequency will be multiplier (N) x base
frequency.
3. fBus = (fINTOSC / 4) x N when internal clock source selected
4. Multiplier must be chosen to limit the maximum bus frequency of 4 MHz for 2.7-V operation and 8 MHz for 4.5-V operation.
B.4.7 External Oscillator Characteristics
Characteristic(1)
Symbol
Min
Typ
Max
Unit
External clock option(2), (3)
With ICG clock disabled
With ICG clock enabled
EXTSLOW = 1(4)
EXTSLOW = 0(4)
dc(5)
â
32 M(6)
fEXTOSC
Hz
60
â
307.2 k
307.2 k
â
32 M(6)
External crystal options(7), (8)
EXTSLOW = 1(4)
EXTSLOW = 0(4)
fEXTOSC
30 k
1M
â
100 k
Hz
â
8M
Crystal load capacitance(9)
CL
â
â
â
pF
Crystal fixed capacitance(9)
C1
â
2 x CL
â
pF
Crystal tuning capacitance(9)
C2
â
2 x CL
â
pF
Feedback bias resistor(9)
RB
â
10
â
Mâ¦
Series resistor (9), (10)
RS
â
â
â
Mâ¦
1. VDD = 5.5 to 2.7 Vdc, VSS = 0 Vdc, TA = â40°C to +85°C, unless otherwise noted
2. Setting EXTCLKEN configuration option enables OSC1 pin for external clock square-wave input.
3. No more than 10% duty cycle deviation from 50%
4. EXTSLOW configuration option configures external oscillator for a slow speed crystal and sets the clock monitor circuits
of the ICG module to expect an external clock frequency that is higher/lower than the internal oscillator base frequency,
fINTOSC.
5. Some modules may require a minimum frequency greater than dc for proper operation. See appropriate table for this
information.
6. MCU speed derates from 32 MHz at VDD = 4.5 Vdc to 16 MHz at VDD = 2.7 Vdc.
7. Setting EXTCLKEN and EXTXTALEN configuration options enables OSC1 and OSC2 pins for external crystal option.
8. fBus = (fEXTOSC / 4) when external clock source is selected.
9. Consult crystal vendor data sheet, see Figure 7-3. External Clock Generator Block Diagram.
10. Not required for high-frequency crystals
MC68HC908KX8 ⢠MC68HC908KX2 ⢠MC68HC08KX8 Data Sheet, Rev. 2.1
Freescale Semiconductor
205
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