MC908KX2MDWE Datasheet, PDF (194/210 Pages) Freescale Semiconductor, Inc – High-performance M68HC08 architecture, Fully upward-compatible object code with M6805, M146805, and M68HC05 Families

Ordering Information and Mechanical Specifications
18.3 16-Pin Plastic Dual In-Line Package (PDIP)
-A-
16
9
-B-
1
8
F
C
L
S
-T-
SEATING
PLANE
H
G
K
J
D 16 PL
0.25 (0.010)M T B S A S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
6. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.760 18.80 19.30
B 0.245 0.260 6.23 6.60
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.050 0.070 1.27 1.77
M
G 0.100 BSC
2.54 BSC
H 0.050 BSC
1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.120 0.140 3.05 3.55
L 0.295 0.305 7.50 7.74
M 0 _° 10 _° 0 _° 10 _°
S 0.015 0.035 0.39 0.88
18.4 16-Pin Small Outline Package (SOIC)
D
A
θ
16
9
1
8
16X B
B
0.25 M T A S B S
14X e
SEATING
PLANE
T
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
θ 0_° 7_°
MC68HC908KX8 • MC68HC908KX2 • MC68HC08KX8 Data Sheet, Rev. 2.1
194
Freescale Semiconductor