W79E217A Datasheet, PDF (4/207 Pages) Winbond – 8-bit Microcontroller

Preliminary W79E217A Data Sheet
23.2 The Loader Program Locates at APFlash Memory .................................................... 187
24. OPTION BITS ......................................................................................................................... 188
24.1 Config0........................................................................................................................ 188
24.2 Config1........................................................................................................................ 189
25. ELECTRICAL CHARACTERISTICS....................................................................................... 190
25.1 Absolute Maximum Ratings ........................................................................................ 190
25.2 DC Characteristics ...................................................................................................... 190
25.3 AC Characteristics ...................................................................................................... 193
25.3.1 External Clock Characteristics....................................................................................193
25.3.2 AC Specification .........................................................................................................193
25.3.3 MOVX Characteristics Using Stretch Memory Cycle ..................................................194
25.4 The ADC Converter DC ELECTRICAL CHARACTERISTICS ................................... 196
25.5 I2C Bus Timing Characteristics .................................................................................. 196
25.6 Program Memory Read Cycle .................................................................................... 197
25.7 Data Memory Read Cycle........................................................................................... 198
25.8 Data Memory Write Cycle........................................................................................... 198
26. TYPICAL APPLICATION CIRCUITS ...................................................................................... 199
26.1 Crystal connections .................................................................................................... 199
26.2 Expanded External Data Memory and Oscillator........................................................ 199
27. PACKAGE DIMENSION ......................................................................................................... 200
27.1 100L QFP (14x20x2.75mm footprint 3.2mm) ............................................................. 200
28. APPLICATION NOTE ............................................................................................................. 201
29. REVISION HISTORY .............................................................................................................. 207
Publication Release Date: December 14, 2007
-4-
Revision A3.0