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MSP432P401R Datasheet, PDF (27/157 Pages) Texas Instruments – Mixed-Signal Microcontrollers
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MSP432P401R, MSP432P401M
SLAS826B – MARCH 2015 – REVISED FEBRUARY 2016
5.10.2 Reset Timing
Table 5-15. Reset Recovery Latencies
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
MIN
TYP
MAX
tSOFT
Latency from release of soft reset to first CPU instruction fetch
5
tHARD
Latency from release of hard reset to release of soft reset
tPOR
Latency from release of device POR to release of hard reset
tCOLDPWR,100 nF
Latency from a cold power-up condition to release of device
POR, CVCORE = 100 nF
tCOLDPWR,4.7 µF
Latency from a cold power-up condition to release of device
POR, CVCORE = 4.7 µF
(1) Refer to Section 6.7.1 for details on the various classes of resets on the device
25
15
25
410
1000
530
1600
UNIT
MCLK
cycles
MCLK
cycles
µs
µs
µs
Table 5-16. External Reset (RSTn) Recovery Latencies
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP
tAMLDO0_RSTn, 16MHz
External reset applied on RSTn pin while the device is in
AM_LDO_VCORE0 mode with MCLK = 16 MHz,
The latency is from release of external reset to start of application code
TBD
tAMLDO1_RSTn, 32MHz
External reset applied on RSTn pin while the device is in
AM_LDO_VCORE1 mode with MCLK = 32 MHz,
The latency is from release of external reset to start of application code
TBD
tAMLDO1_RSTn, 48MHz
External reset applied on RSTn pin while the device is in
AAM_LDO_VCORE1 mode with MCLK = 48 MHz,
The latency is from release of external reset to start of application code
TBD
tAMDCDC0_RSTn, 16MHz
External reset applied on RSTn pin while the device is in
AM_DCDC_VCORE0 mode with MCLK = 16 MHz,
The latency is from release of external reset to start of application code
TBD
tAMDCDC1_RSTn, 48MHz
External reset applied on RSTn pin while the device is in
AM_DCDC_VCORE1 mode with MCLK = 48 MHz,
The latency is from release of external reset to start of application code
TBD
tAMLF0_RSTn, 128kHz
External reset applied on RSTn pin while the device is in
AM_LF_VCORE0 mode with MCLK = 128 kHz from REFO,
The latency is from release of external reset to start of application code
TBD
tAMLF0_RSTn, 32kHz
External reset applied on RSTn pin while the device is in
AM_LF_VCORE0 mode with MCLK = 32 kHz from LFXT,
The latency is from release of external reset to start of application code
TBD
tAMLF1_RSTn, 128kHz
External reset applied on RSTn pin while the device is in
AM_LF_VCORE1 mode with MCLK = 128 kHz from REFO,
The latency is from release of external reset to start of application code
TBD
tLPM0LDO0_RSTn, 16MHz
External reset applied on RSTn pin while the device is in
LPM0_LDO_VCORE0 mode with MCLK = 16 MHz,
The latency is from release of external reset to start of application code
TBD
tLPM0LDO1_RSTn, 48MHz
External reset applied on RSTn pin while the device is in
LPM0_LDO_VCORE1 mode with MCLK = 48 MHz,
The latency is from release of external reset to start of application code
TBD
External reset applied on RSTn pin while the device is in
tLPM0DCDC0_RSTn, 16MHz LPM0_DCDC_VCORE0 mode with MCLK = 16 MHz,
The latency is from release of external reset to start of application code
TBD
External reset applied on RSTn pin while the device is in
tLPM0DCDC1_RSTn, 48MHz LPM0_DCDC_VCORE1 mode with MCLK = 48 MHz,
The latency is from release of external reset to start of application code
TBD
tLPM0LF0_RSTn, 128kHz
External reset applied on RSTn pin while the device is in
LPM0_LF_VCORE0 mode with MCLK = 128 kHz from REFO,
The latency is from release of external reset to start of application code
TBD
MAX UNIT
4 ms
4 ms
4 ms
4 ms
4 ms
4 ms
4 ms
4 ms
4 ms
4 ms
4 ms
4 ms
4 ms
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Specifications
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