MSP432P401R Datasheet, PDF (150/157 Pages) Texas Instruments – Mixed-Signal Microcontrollers

MSP432P401R, MSP432P401M
SLAS826B – MARCH 2015 – REVISED FEBRUARY 2016
ZXH 80 (NFBGA - 1 mm max height)
B
5.1
4.9
BALL A1 CORNER
INDEX AREA
www.ti.com
PACKAGE OUTLINE
BALL GRID ARRAY
A
5.1
4.9
0.7
0.6
1 MAX
0.25
0.15
TYP
BALL TYP
4 TYP
SYMM
C
SEATING PLANE
0.08 C
4
TYP
0.5 TYP
J
H
G
F
SYMM
E
D
C
B
A
12 345 6 7 89
80X
0.35
0.25
0.15 C B A
0.05 C
0.5 TYP
4221325/A 01/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis is for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This is a Pb-free solder ball design.
150 Mechanical, Packaging, and Orderable Information
Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP432P401R MSP432P401M