82845MP Datasheet, PDF (128/157 Pages) Intel Corporation – Intel 845 Family Chipset-Mobile 82845MP/82845MZ Chipset Memory Controller Hub Mobile (MCH-M)

Intel^®82845MP/82845MZ Chipset-Mobile (MCH-M)
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7. Signal Groups
The signal description includes the type of buffer used for the particular signal.
AGTL+
Open Drain AGTL+ interface signal. Refer to the AGTL+ I/O Specification for complete
details. The Intel 845MP/845MZ Chipset MCH-M integrates most AGTL+ termination
resistors.
AGP
AGP interface signals. These signals are compatible with AGP 2.0 1.5 V Signaling
Environment DC and AC Specifications. The buffers are not 3.3 V tolerant.
HI CMOS Hub Interface 1.8 V CMOS buffers.
DDR CMOS DDR System memory 2.5 V CMOS buffers.
Table 37. Signal Groups
Signal Group
Signal Type
Signals
Notes
Host Interface Signal Groups
(a)
AGTL+ I/O
(b)
AGTL+ Common
Clock Output
(c)
AGTL+ Common
Clock Input
(d)
Host Reference
Voltages
AGP Interface Signal Groups
(e)
AGP I/O
(f)
AGP Input
(g)
AGP Output
(h)
AGP Reference
Voltage
Hub Interface Signal Groups
(i)
Hub Interface’s
CMOS I/O
(j)
Hub Interface
Reference
Voltage
DDR Interface Signal Groups
ADS#, BNR#, BR0#,DBSY#, DBI[3:0]#, DRDY#,
HA[31:3]#, HADSTB[1:0] #,
HD[63:0]#,HDSTBP[3:0]#, HDSTBN[3:0]#, HIT#,
HITM#, HREQ[4:0]#
BPRI#, CPURST#, DEFER#, HTRDY#, RS[2:0]#
HLOCK#
HVREF, HSWING[1:0]
AD_STB0, AD_STB0#, AD_STB1, AD_STB1#,
G_FRAME#, G_IRDY#, G_TRDY#, G_STOP#,
G_DEVSEL#, G_AD[31:0], G_CBE[3:0]#, G_PAR
PIPE#, SBA[7:0], RBF#, WBF#, SB_STB,
SB_STB#, G_REQ#
ST[2:0], G_GNT#
AGPREF
HI_[10:0], HI_STB, HI_STB#
HI_REF
128
Datasheet
250687-002