82845MP Datasheet, PDF (126/157 Pages) Intel Corporation – Intel 845 Family Chipset-Mobile 82845MP/82845MZ Chipset Memory Controller Hub Mobile (MCH-M)

Intel^®82845MP/82845MZ Chipset-Mobile (MCH-M)
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6. Electrical Characteristics
This chapter contains the absolute maximum operating ratings, power characteristics, and DC
characteristics for the 845MP/845MZ MCH-M.
6.1. Absolute Maximum Ratings
Table 34 lists the Intel 845MP/845MZ Chipset MCH-M maximum environmental stress ratings.
Functional operation at the absolute maximum and minimum is neither implied nor guaranteed.
Functional operating parameters are listed in the AC and DC tables.
Warning: Stressing the device beyond the “Absolute Maximum Ratings” may cause permanent damage. These are
stress ratings only. Operating beyond the “operating conditions” is not recommended and extended
exposure beyond “operating conditions” may affect reliability.
Table 34. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Notes
Tdie
Die Temperature under Bias (with heatsink)
Tdie
Die Temperature under Bias (without heatsink)
0
98
°C
0
104
°C
Tstorage
VCC1_5
Storage Temperature
1.5 V Supply Voltage with respect to Vss
-55
150
°C
-0.72
2.69
V
VCC1_8
1.8 V Supply Voltage with respect to Vss
-0.88
2.5
V
VCCSM
2.5 V DDR Supply Voltage with respect to Vss
-3.60
6.3
V
VTT
AGTL+ buffer DC input voltage with respect to Vss
-0.55
2.3
V
VIL, VIH
(DDR)
Voltage on 2.5 V DDR tolerant input pins with
respect to Vss
-3.60
6.30
V
6.2. Thermal Characteristics
The Intel 845MP/845MZ Chipset MCH-M is designed for operation at die temperatures between 0°C
and 104°C. The thermal resistance of the package is given in Table 35.
Table 35. Intel 845MP/845MZ Chipset MCH-M Package Thermal Resistance
Parameter
Airflow Velocity in Meters/Second
0 m/s
1 m/s
Ψjt (°C/Watt)**
0.5
1.8
Θja (°C/Watt)**
20.0
17.3
NOTE: ** Typical value measured in accordance with EIA/JESD 51-2 testing standard.
126
Datasheet
250687-002