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HYB18T512400AF Datasheet, PDF (56/117 Pages) Infineon Technologies AG – 512-Mbit DDR2 SDRAM
HYB18T512[40/80/16]0AF–[3/3S/3.7/5]
512-Mbit DDR2 SDRAM
Functional Description
3.20
Write Data Mask
One write data mask input (DM) for ×4 and ×8
components and two write data mask inputs (LDM,
UDM) for ×16 components are supported on DDR2
SDRAM’s, consistent with the implementation on DDR
SDRAM’s. It has identical timings on write operations
as the data bits, and though used in a uni-directional
manner, is internally loaded identically to data bits to
insure matched system timing. Data mask is not used
during read cycles. If DM is HIGH during a write burst
coincident with the write data, the write data bit is not
written to the memory. For ×8 components the DM
function is disabled, when RDQS / RDQS are enabled
by EMRS(1).
T$1 3 ( T$1 3 ,
$1 3 $ 13
$1
$-
T70 2 %
T70 3 4
T
$3
$IN
$IN
$IN
T
$(
$IN
DONgTCARE
Figure 36 Write Data Mask Timing
-0 4 4 
4
4
4
4
4
#,+
#,+
#-$
$13
$13
7RITE!
./0
T$13 3
7, 2, 
./0
./0
./0
$1
$IN $IN $IN $IN
! ! ! !
$-
4
4
4
4
./0
./0
0REC H ARG E
./0
T72
T20
4
4
4
"ANK !
!CTIVA TE
./0
Figure 37 Write Operation with Data Mask Example
RL = 3 (AL = 0, CL = 3), WL = 2, tWR = 3, BL = 4
-0 44  
Data Sheet
56
Rev. 1.3, 2005-01
09112003-SDM9-IQ3P