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MC9S12E128CFUE Datasheet, PDF (600/606 Pages) Freescale Semiconductor, Inc – MC9S12E128 Data Sheet
Appendix B Package Information
B.2 80-Pin QFP Package
L
60
61
41
40
-A-
L
DETAIL A
-B-
B
V
B
B
P
DETAIL A
-A-,-B-,-D-
80
1
E
C
-C-
SEATING
H
PLANE
-D-
A
0.20M H A-B S D S
0.05 A-B
S
0.20 M C A-B S D S
G
U
T
DATUM
PLANE
-H-
R
K
Q
W
X
DETAIL C
21
20
F
J
N
M
DETAIL C
D
0.20 M C A-B S D S
-H-
DATUM
PLANE
0.10
SECTION B-B
VIEW ROTATED 90 °
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
4. DATUMS -A-, -B- AND -D- TO BE
DETERMINED AT DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -C-.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
MILLIMETERS
DIM MIN MAX
A 13.90 14.10
B 13.90 14.10
C 2.15 2.45
D 0.22 0.38
E 2.00 2.40
F 0.22 0.33
G
0.65 BSC
H
--- 0.25
J 0.13 0.23
K 0.65 0.95
L 12.35 REF
M
5° 10°
N 0.13 0.17
P 0.325 BSC
Q
0°
7°
R 0.13 0.30
S 16.95 17.45
T 0.13 ---
U
0° ---
V 16.95 17.45
W 0.35 0.45
X
1.6 REF
Figure B-2. 80-Pin QFP Mechanical Dimensions (Case no. 841B)
MC9S12E128 Data Sheet, Rev. 1.07
600
Freescale Semiconductor