MC9S08GB60 Datasheet, PDF (284/290 Pages) Motorola, Inc – Microcontrollers

Appendix B Ordering Information and Mechanical Drawings
B.5 44-Pin QFP Package Drawing
33
34
L
23
22
-A-
-B-
44
1
DETAIL A
12
11
-D-
A
0.20 (0.008) M C A-B S D S
0.05 (0.002) A-B
S
0.20 (0.008) M H A-B S D S
M
DETAIL C
CE
-C-
SEATING
H
PLANE
G
-H-
DATUM
PLANE
0.01 (0.004)
M
DATUM
PLANE
-H-
M
T
R
K
W
Q
X
DETAIL C
CASE 824A-01
ISSUE O
B
B
-A-, -B-, -D-
DETAIL A
F
BASE METAL
J
N
D
0.20 (0.008) ^M C A-B ^S D ^S
SECTION B-B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE BOTTOM OF THE
PARTING LINE.
4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT DATUM
PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING
PLANE -C-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010)
PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT DATUM PLANE
-H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS
OR THE FOOT.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.90 10.10 0.390 0.398
B 9.90 10.10 0.390 0.398
C 2.10 2.45 0.083 0.096
D 0.30 0.45 0.012 0.018
E 2.00 2.10 0.079 0.083
F 0.30 0.40 0.012 0.016
G
0.80 BSC
0.031 BSC
H
--- 0.25
--- 0.010
J 0.013 0.23 0.005 0.009
K 0.65 0.95 0.026 0.037
L
8.00 REF
0.315 REF
M
5_° 10_° 5_° 10_°
N 0.13 0.17 0.005 0.007
Q 0_° 7_° 0_° 7_°
R 0.13 0.30 0.005 0.012
S 12.95 13.45 0.510 0.530
T 0.13
--- 0.005
---
U
0_°
---
0_°
---
V 12.95 13.45 0.510 0.530
W 0.40
--- 0.016
---
X
1.6 REF
0.063 REF
DATE 11/19/90
MC9S08GB/GT Data Sheet, Rev. 2.3
284
Freescale Semiconductor