MC9S08GB60 Datasheet, PDF (282/290 Pages) Motorola, Inc – Microcontrollers

Appendix B Ordering Information and Mechanical Drawings
B.3 64-Pin LQFP Package Drawing
4X
0.2 H A-B D
64
1
A
4X 16 TIPS
0.2 C A-B D
49
48
B
A2
0.05 S
(S)
2X R R1
q1
0.25
q
GAGE PLANE
3X
VIEW Y
16
17
D
D1/2
D/2
D1
D
E1 E
33
32
E1/2
E/2
HA
4X (q 2)
0.08 C
(L2)
A1
L
(L1)
VIEW AA
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE DATUM H IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS A, B AND D TO BE DETERMINED AT DATUM
PLANE DATUM C.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE DATUM C.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
PER SIDE.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE b DIMENSION TO EXCEED 0.35.
MINIMUM SPACE BETWEEN PROTRUSION AND
ADJACENT LEAD OR PROTRUSION 0.07.
C
SEATING
PLANE
4X (q 3)
VIEW AA
X
X=A, B OR D
CL
AB
AB
VIEW Y
e/2
60X e
BASE METAL
b1
c
c1
PLATING
b
0.08 M C A-B D
SECTION AB-AB
ROTATED 90 _° CLOCKWISE
MILLIMETERS
DIM MIN MAX
A
--- 1.60
A1 0.05 0.15
A2 1.35 1.45
b 0.17 0.27
b1 0.17 0.23
c 0.09 0.20
c1 0.09 0.16
D 12.00 BSC
D1 10.00 BSC
e
0.50 BSC
E 12.00 BSC
E1 10.00 BSC
L 0.45 0.75
L1
1.00 REF
L2
0.50 REF
R1 0.10 0.20
S
0.20 REF
q
0 _° 7°
q1
0_°
---
q 2 12 ° REF
q 3 12 ° REF
CASE 840F-02
ISSUE B
DATE 09/16/98
MC9S08GB/GT Data Sheet, Rev. 2.3
282
Freescale Semiconductor