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MC68HC908GP32_08 Datasheet, PDF (236/266 Pages) Freescale Semiconductor, Inc – M68HC08 Microcontrollers
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Electrical Specifications
Characteristic(1)
Pullup resistors (as input only)
Ports PTA7/KBD7–PTA0/KBD0, PTC6–PTC0,
PTD7/T2CH1–PTD0/SS
Capacitance
Ports (as input or output)
Symbol
Min
Typ(2)
Max
Unit
RPU
20
45
65
kΩ
COut
CIn
—
—
—
—
12
8
pF
Monitor mode entry voltage
Low-voltage inhibit, trip falling voltage
Low-voltage inhibit, trip rising voltage
Low-voltage inhibit reset/recover hysteresis
(VTRIPF + VHYS = VTRIPR)
POR rearm voltage(12)
POR reset voltage(13)
POR rise time ramp rate(14)
Notes:
VTST
VTRIPF
VTRIPR
VHYS
VPOR
VPORRST
RPOR
VDD + 2.5
3.90
4.20
—
0
0
0.035
—
4.25
4.35
100
—
700
—
9
V
4.50
V
4.60
V
—
mV
100
mV
800
mV
—
V/ms
1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH, unless otherwise noted
2. Typical values reflect average measurements at midpoint of voltage range, 25 °C only.
3. Run (operating) IDD measured using external square wave clock source (fOSC = 32.8 MHz). All inputs 0.2V from rail. No
dc loads. Less than 100 pF on all outputs. CL = 20 pF on OSC2. All ports configured as inputs. OSC2 capacitance linearly
affects run IDD. Measured with all modules enabled.
4. Wait IDD measured using external square wave clock source (fOSC = 32.8 MHz). All inputs 0.2 V from rail. No dc loads.
Less than 100 pF on all outputs. CL = 20 pF on OSC2. All ports configured as inputs. OSC2 capacitance linearly affects
wait IDD. Measured with PLL and LVI enabled.
5. Stop IDD is measured with OSC1 = VSS.
6. Stop IDD with TBM enabled is measured using an external square wave clock source (fOSC = 32.8 MHz). All inputs 0.2V
from rail. No dc loads. Less than 100 pF on all outputs. All inputs configured as inputs.
7. This parameter is characterized and not tested on each device.
8. All functional non-supply pins are internally clamped to VSS and VDD.
9. Input must be current limited to the value specified. To determine the value of the required current-limiting resistor,
calculate resistance values for positive and negative clamp voltages, then use the larger of the two values.
10. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current
conditions. If positive injection current (Vin > VDD) is greater than IDD, the injection current may flow out of VDD and could
result in external power supply going out of regulation. Ensure external VDD load will shunt current greater than maximum
injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock
is present, or if clock rate is very low (which would reduce overall power consumption).
11. Pullups and pulldowns are disabled. Port B leakage is specified in 19.12 ADC Characteristics.
12. Maximum is highest voltage that POR is guaranteed.
13. Maximum is highest voltage that POR is possible.
14. If minimum VDD is not reached before the internal POR reset is released, RST must be driven low externally until minimum
VDD is reached.
MC68HC908GP32 Data Sheet, Rev. 10
236
Freescale Semiconductor
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