MC68HC705JJ7 Datasheet, PDF (159/164 Pages) Freescale Semiconductor, Inc – Microcontrollers

28-Pin Small Outline Integrated Circuit (Case 751F)
16.5 28-Pin Small Outline Integrated Circuit (Case 751F)
28
1
-T-
-A-
15
-B-
14X P
0.010 (0.25) ^M B ^M
14
28X D
0.010 (0.25) ^M T A ^S B ^S
M
R X 45°
26X G
C
-T-
SEATING
PLANE
K
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 17.80 18.05 0.701 0.711
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F
F 0.41 0.90 0.016 0.035
G
1.27 BSC
0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M
0°
8°
0°
8°
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
16.6 20-Pin Windowed Ceramic Integrated Circuit (Case 732)
20
1
A
F
H
D
SEATING
PLANE
11
10
B
C
N
K
G
L
J
M
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
INCHES
DIM MIN MAX
A 0.940 0.990
B 0.260 0.295
C 0.150 0.200
D 0.015 0.022
F 0.055 0.065
G 0.100 BSC
H 0.020 0.050
J 0.008 0.012
K 0.125 0.160
L 0.300 BSC
M
0_ 15_
N 0.010 0.040
MC68HC705JJ7 • MC68HC705JP7 Advance Information Data Sheet, Rev. 4.1
Freescale Semiconductor
159