MC68HC705JJ7 Datasheet, PDF (157/164 Pages) Freescale Semiconductor, Inc – Microcontrollers

Chapter 16
Mechanical Specifications
16.1 Introduction
The MC68HC705JJ7 is available in:
• 20-pin plastic dual in-line package (PDIP)
• 20-pin small outline integrated circuit (SOIC) package
• 20-pin windowed ceramic package
The MC68HC705JP7 is available in:
• 28-pin plastic dual in-line package (PDIP)
• 28-pin small outline integrated circuit (SOIC) package
• 28-pin windowed ceramic package
The following figures show the latest package drawings at the time of this publication. To make sure that
you have the latest package specifications, contact your local Freescale Sales Office.
16.2 20-Pin Plastic Dual In-Line Package (Case 738)
-A-
20
1
-T-
SEATING
PLANE
E
G
F
11
B
10
C
K
N
D 20 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
L
FLASH.
M
J 20 PL
0.25 (0.010) ^M T B ^M
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E
0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G
0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L
0.300 BSC
7.62 BSC
M
0° 15° 0° 15°
N 0.020 0.040 0.51 1.01
MC68HC705JJ7 • MC68HC705JP7 Advance Information Data Sheet, Rev. 4.1
Freescale Semiconductor
157