W641GG2JB Datasheet, PDF (106/109 Pages) Winbond – 1-Gbit GDDR3 Graphics SDRAM

W641GG2JB
8. PACKAGE SPECIFICATION
1-Gbit GDDR3 Graphics SDRAM
Package Outline TFBGA 136 (10x14 mm², ball pitch:0.8mm, Ø =0.45mm)
14
0.18 MAX.
16 x 0.8 = 12.8
0.8
0.12 MAX.
0.2
2)
B
5)
4)
2)
A
0.1 C
1)
3)
0.1 C
O 0.45±0.05 ⁶⁾
O 0.15 M C A B
O 0.08 M C
C SEATING PLANE
Lead free solder balls (green solder balls)
1) Bad unit marking (BUM) (light = good)
2) Middle of packages edges
3) Package orientation mark A1
4) SBA- fiducial (solder ball attach)
5) Bare core area
6) Solder ball diameter refers to post reflow conduction
- 106 -
Publication Release Date: Apr, 22, 2011
Revision A01-002