SM320C6414-EP_16 Datasheet, PDF (90/93 Pages) Texas Instruments – FIXED-POINT DIGITAL SIGNAL PROCESSORS

PACKAGE OPTION ADDENDUM
www.ti.com
29-Jan-2016
PACKAGING INFORMATION
Orderable Device
SM32C6414DGLZ50AEP
SM32C6415DGLZ50AEP
SM32C6415EGLZ50AEP
Status Package Type Package Pins Package
(1)
Drawing
Qty
OBSOLETE FCBGA
GLZ 532
OBSOLETE FCBGA
GLZ 532
ACTIVE FCBGA
GLZ 532 60
Eco Plan
(2)
TBD
TBD
TBD
SM32C6415EGLZ50SEP
ACTIVE
FCBGA
GLZ 532 60
TBD
SM32C6416DGLZ50AEP
SM32C6416EGLZ50AEP
V62/04609-01XA
V62/04609-02XA
V62/04609-03XA
V62/04609-05XA
OBSOLETE
NRND
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
GLZ 532
GLZ 532 60
GLZ 532
GLZ 532
GLZ 532
GLZ 532 60
TBD
TBD
TBD
TBD
TBD
TBD
V62/04609-08XA
ACTIVE FCBGA
GLZ 532 60
TBD
Lead/Ball Finish
(6)
Call TI
Call TI
SNPB
SNPB
Call TI
Call TI
Call TI
Call TI
Call TI
SNPB
SNPB
MSL Peak Temp Op Temp (°C)
(3)
Call TI
-40 to 105
Call TI
-40 to 105
Level-4-220C-72 HR -40 to 105
Level-4-220C-72 HR -55 to 105
Call TI
Call TI
Call TI
Call TI
Call TI
Level-4-220C-72 HR
-40 to 105
-40 to 105
-40 to 105
-40 to 105
-40 to 105
-40 to 105
Level-4-220C-72 HR -55 to 105
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
SM32C6415EGLZ5
0AEP
SM32C6415EGLZ5
0SEP
SM32C6415EGLZ5
0AEP
SM32C6415EGLZ5
0SEP
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 1