LM3S1651 Datasheet, PDF (9/1033 Pages) Texas Instruments – ARM and Thumb are registered trademarks and Cortex is a trademark

Stellaris^® LM3S1651 Microcontroller
21.2 108-Ball BGA Package Pin Tables ................................................................................ 937
21.3 Connections for Unused Signals ................................................................................... 968
22 Operating Characteristics ................................................................................... 970
23 Electrical Characteristics .................................................................................... 971
23.1 Maximum Ratings ....................................................................................................... 971
23.2 Recommended Operating Conditions ........................................................................... 971
23.3 Load Conditions .......................................................................................................... 972
23.4 JTAG and Boundary Scan ............................................................................................ 972
23.5 Power and Brown-Out ................................................................................................. 974
23.6 Reset ......................................................................................................................... 975
23.7 On-Chip Low Drop-Out (LDO) Regulator ....................................................................... 976
23.8 Clocks ........................................................................................................................ 976
23.8.1 PLL Specifications ....................................................................................................... 976
23.8.2 PIOSC Specifications .................................................................................................. 977
23.8.3 Internal 30-kHz Oscillator Specifications ....................................................................... 977
23.8.4 Hibernation Clock Source Specifications ....................................................................... 978
23.8.5 Main Oscillator Specifications ....................................................................................... 978
23.8.6 System Clock Specification with ADC Operation ............................................................ 979
23.9 Sleep Modes ............................................................................................................... 979
23.10 Hibernation Module ..................................................................................................... 979
23.11 Flash Memory ............................................................................................................. 981
23.12 Input/Output Characteristics ......................................................................................... 981
23.13 Analog-to-Digital Converter (ADC) ................................................................................ 982
23.14 Synchronous Serial Interface (SSI) ............................................................................... 983
23.15 Inter-Integrated Circuit (I²C) Interface ........................................................................... 985
23.16 Inter-Integrated Circuit Sound (I²S) Interface ................................................................. 986
23.17 Analog Comparator ..................................................................................................... 987
23.18 Current Consumption .................................................................................................. 988
23.18.1 Nominal Power Consumption ....................................................................................... 988
23.18.2 Maximum Current Consumption ................................................................................... 989
A Register Quick Reference ................................................................................... 991
B Ordering and Contact Information ................................................................... 1021
B.1 Ordering Information .................................................................................................. 1021
B.2 Part Markings ............................................................................................................ 1021
B.3 Kits ........................................................................................................................... 1022
B.4 Support Information ................................................................................................... 1022
C
C.1
C.1.1
C.1.2
C.1.3
C.2
C.2.1
C.2.2
C.2.3
Package Information .......................................................................................... 1023
100-Pin LQFP Package ............................................................................................. 1023
Package Dimensions ................................................................................................. 1023
Tray Dimensions ....................................................................................................... 1025
Tape and Reel Dimensions ........................................................................................ 1025
108-Ball BGA Package .............................................................................................. 1027
Package Dimensions ................................................................................................. 1027
Tray Dimensions ....................................................................................................... 1029
Tape and Reel Dimensions ........................................................................................ 1030
January 21, 2012
9
Texas Instruments-Production Data