MC68HC705C9A_1 Datasheet, PDF (149/157 Pages) Freescale Semiconductor, Inc – General Release Specification

Freescale Semiconductor, Inc.
General Release Specification — MC68HC705C9A
Section 14. Ordering Information
14.1 Contents
14.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .149
14.3 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .149
14.2 Introduction
This section contains ordering information for the available package
types.
14.3 MC Order Numbers
Table 14-1 shows the MC order numbers for the available package
types.
Table 14-1. MC Order Numbers
Package Type
40-Pin Plastic Dual In-Line Package (DIP)
42-Pin Shrink Dual In-Line Package (SDIP)
44-Lead Plastic Leaded Chip Carrier (PLCC)
44-Pin Quad Flat Pack (QFP)
NOTES:
1. P = Plastic dual in-line package (PDIP)
2. B = Shrink dual in-line package (SDIP)
3. FN = Plastic-leaded chip carrier (PLCC)
4. FB = Quad flat pack (QFP)
Temperature
Range
–40 °C to 85°C
–40 °C to 85°C
–40 °C to 85°C
–40 °C to 85°C
Order Number
MC68HC705C9ACP
MC68HC705C9ACB
MC68HC705C9ACFN
MC68HC705C9ACFB
MC68HC705C9A — Rev. 2.0
Ordering Information
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