|
MC68HC705C9A_1 Datasheet, PDF (148/157 Pages) Freescale Semiconductor, Inc – General Release Specification | |||
|
◁ |
Freescale Semiconductor, Inc.
General Release Speciï¬cation 44-Lead Quad Flat Pack (QFP) (Case 824A-01)
13.6 44-Lead Quad Flat Pack (QFP) (Case 824A-01)
L
33
34
23
22
-A-
L
-B-
B
V
B
-A,B,D-
B
DETAIL A
44
12
DETAIL A
CE
-C-
SEATING H
PLANE
DATUM
PLANE
-H-
1
11
-D-
A
0.20 (0.008) M C A-B S D S
0.05 (0.002) A-B
S
0.20 (0.008) M H A-B S D S
M
G
M
T
R
K
W
Q
X
DETAIL C
F
BASE METAL
J
N
D
DETAIL C
0.20 (0.008) M C A-B S D S
SECTION BâB
-H-
DATUM
PLANE
0.01 (0.004)
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE ÄHÄ IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS ÄAÄ, ÄBÄ AND ÄDÄ TO BE DETERMINED AT
DATUM PLANE ÄHÄ.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE ÄCÄ.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE ÄHÄ.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
MILLIMETERS
DIM MIN MAX
A 9.90 10.10
B 9.90 10.10
C 2.10 2.45
D 0.30 0.45
E 2.00 2.10
F 0.30 0.40
G
0.80 BSC
H
Ä 0.25
J 0.13 0.23
K 0.65 0.95
L
8.00 REF
M
5°
10°
N 0.13 0.17
Q
0°
7°
R 0.13 0.30
S 12.95 13.45
T 0.13 Ä
U
0°
Ä
V 12.95 13.45
W 0.40 Ä
X
1.6 REF
INCHES
MIN MAX
0.390 0.398
0.390 0.398
0.083 0.096
0.012 0.018
0.079 0.083
0.012 0.016
0.031 BSC
Ä 0.010
0.005 0.009
0.026 0.037
0.315 REF
5° 10°
0.005 0.007
0°
7°
0.005 0.012
0.510 0.530
0.005 Ä
0° Ä
0.510 0.530
0.016 Ä
0.063 REF
Figure 13-4. 44-Lead QFP (Case 824A-01)
MC68HC705C9A â Rev. 2.0
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
|
▷ |