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MC68HC705C9A_1 Datasheet, PDF (148/157 Pages) Freescale Semiconductor, Inc – General Release Specification
Freescale Semiconductor, Inc.
General Release Specification 44-Lead Quad Flat Pack (QFP) (Case 824A-01)
13.6 44-Lead Quad Flat Pack (QFP) (Case 824A-01)
L
33
34
23
22
-A-
L
-B-
B
V
B
-A,B,D-
B
DETAIL A
44
12
DETAIL A
CE
-C-
SEATING H
PLANE
DATUM
PLANE
-H-
1
11
-D-
A
0.20 (0.008) M C A-B S D S
0.05 (0.002) A-B
S
0.20 (0.008) M H A-B S D S
M
G
M
T
R
K
W
Q
X
DETAIL C
F
BASE METAL
J
N
D
DETAIL C
0.20 (0.008) M C A-B S D S
SECTION B–B
-H-
DATUM
PLANE
0.01 (0.004)
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE ĆHĆ IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS ĆAĆ, ĆBĆ AND ĆDĆ TO BE DETERMINED AT
DATUM PLANE ĆHĆ.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE ĆCĆ.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE ĆHĆ.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
MILLIMETERS
DIM MIN MAX
A 9.90 10.10
B 9.90 10.10
C 2.10 2.45
D 0.30 0.45
E 2.00 2.10
F 0.30 0.40
G
0.80 BSC
H
Ċ 0.25
J 0.13 0.23
K 0.65 0.95
L
8.00 REF
M
5°
10°
N 0.13 0.17
Q
0°
7°
R 0.13 0.30
S 12.95 13.45
T 0.13 Ċ
U
0°
Ċ
V 12.95 13.45
W 0.40 Ċ
X
1.6 REF
INCHES
MIN MAX
0.390 0.398
0.390 0.398
0.083 0.096
0.012 0.018
0.079 0.083
0.012 0.016
0.031 BSC
Ċ 0.010
0.005 0.009
0.026 0.037
0.315 REF
5° 10°
0.005 0.007
0°
7°
0.005 0.012
0.510 0.530
0.005 Ċ
0° Ċ
0.510 0.530
0.016 Ċ
0.063 REF
Figure 13-4. 44-Lead QFP (Case 824A-01)
MC68HC705C9A — Rev. 2.0
Mechanical Specifications
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