MC68HC705C9A_1 Datasheet, PDF (146/157 Pages) Freescale Semiconductor, Inc – General Release Specification

Freescale Semiconductor, Inc.
General Release Specification _{40-Pin Plastic Dual In-Line (DIP) Package (Case}
13.3 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03)
40
1
H
A
G
F
21
B
20
C
N
D
K
SEATING
PLANE
L
J
M
NOTES:
1. POSITION TOLERANCE OF LEADS (D), SHALL
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
MILLIMETERS
DIM MIN MAX
A 51.69 52.45
B 13.72 14.22
C 3.94 5.08
D 0.36 0.56
F 1.02 1.52
G
2.54 BSC
H 1.65 2.16
J 0.20 0.38
K 2.92 3.43
L
15.24 BSC
M
0°
1°
N 0.51 1.02
INCHES
MIN MAX
2.035 2.065
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
0.600 BSC
0°
1°
0.020 0.040
Figure 13-1. 40-Pin Plastic DIP Package (Case 711-03)
13.4 42-Pin Plastic Shrink Dual In-Line (SDIP) Package (Case 858-01)
-A-
42
22
-B-
1
21
C
L
H
-T-
SEATING
PLANE
F
G
D 42 PL
0.25 (0.010) M T A S
N
K
M
J 42 PL
0.25 (0.010) M T B S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.435 1.465 36.45 37.21
B 0.540 0.560 13.72 14.22
C 0.155 0.200 3.94 5.08
D 0.014 0.022 0.36 0.56
F 0.032 0.046 0.81 1.17
G 0.070 BSC
1.778 BSC
H 0.300 BSC
7.62 BSC
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.600 BSC
15.24 BSC
M 0° 15° 0° 15°
N 0.020 0.040 0.51 1.02
Figure 13-2. 42-Pin Plastic SDIP Package (Case 858-01)
MC68HC705C9A — Rev. 2.0
Mechanical Specifications
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