MC68HC705C9A_1 Datasheet, PDF (145/157 Pages) Freescale Semiconductor, Inc – General Release Specification

Freescale Semiconductor, Inc.
General Release Specification — MC68HC705C9A
Section 13. Mechanical Specifications
13.1 Contents
13.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145
13.3 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03) . . .146
13.4 42-Pin Plastic Shrink Dual In-Line (SDIP) Package
(Case 858-01). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .146
13.5 44-Lead Plastic Leaded Chip Carrier (PLCC)
(Case 777-02). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .147
13.6 44-Lead Quad Flat Pack (QFP) (Case 824A-01) . . . . . . . . . .148
13.2 Introduction
This section describes the dimensions of the plastic dual in-line package
(DIP), plastic shrink dual in-line package (SDIP), plastic leaded chip
carrier (PLCC), and quad flat pack (QFP) MCU packages. Package
dimensions available at time of this publication are provided in this
section. To make sure that you have the latest case outline
specifications, contact one of the following:
• Local Motorola Sales Office
• Motorola Mfax
– Phone [phone]
– EMAIL [e-mail]
• Worldwide Web (wwweb) at http://design-net.com
Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.
MC68HC705C9A — Rev. 2.0
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com