W83C553F Datasheet, PDF (157/159 Pages) Winbond – SYSTEM I/O CONTROLLER WITH PCI ARBITER

W83C553F
Thermal Information
8.0 Thermal Information
Theta JA = Thermal Resistance between Junction and Ambient for the 208PQFP.
Theta JA = 43.13 ⁰C/W
(air velocity = 0 M/s)
35.25 ⁰C/W(air velocity = 1 M/s)
30.90 ⁰C/W (air velocity = 2M/s)
Theta JA = (T_junction - T_ambient) / P_chip;
Where P_chip = Power dissipation on the chip (in watts)
WINBOND SYSTEMS LABORATORY
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