SM320LF2407-EP Datasheet, PDF (57/112 Pages) Texas Instruments – 
DSP CONTROLLERS

SM320LF2407AĆEP
DSP CONTROLLERS
SGUS036B − JULY 2003 − REVISED OCTOBER 2003
LF240xA ELECTRICAL SPECIFICATIONS DATA
absolute maximum ratings over operating case temperature ranges (unless otherwise noted)^†
Supply voltage range, V_DD, PLLV_CCA, V_DDO, and V_CCA (see Note 1) . . . . . . . . . . . . . . . . . . − 0.3 V to 4.6 V
V_CCP range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 5.5 V
Input voltage range, V_IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 4.6 V
Output voltage range, V_O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 4.6 V
Input clamp current, I_IK (V_IN < 0 or V_IN > V_CC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Output clamp current, I_OK (V_O < 0 or V_O > V_CC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Operating case temperature ranges, T_C: M version (see Notes 2 and 3) . . . . . . . . . . . . . − 55°C to 125°C
Junction temperature range, T_J (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 55°C to 130°C
Storage temperature range, T_stg (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150°C
† _{Clamp current stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress}
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to VSS.
2. Long term high−temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction
of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
3. See the next section on device operating life for important information on temperature ranges.
device operating life
125°C case operating temperature denotes maximum test temperature only. Impact on estimated product life
from continuous operation of this device at elevated temperatures are shown in Figure 14 .
Bond (package) life is based on time-to-first failure due to intermetallic formation. After the first failure is
encountered, the failure rate approaches 100% in a very short time (a matter of months) due to the nature of
the failure mechanism.
Since the bond intermetallic life is a function of package components and temperature only, the 150°C point is
included to indicate the effect of extended high temperature storage.
Electromigration life is based on a FR50 of 50 FITS with an activation energy of 0.75 eV and follows a standard
wear-out curve.
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