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TI380C30 Datasheet, PDF (41/78 Pages) Texas Instruments – INTEGRATED TOKEN-RING COMMPROCESSOR AND PHYSICAL-LAYER INTERFACE
TI380C30
INTEGRATED TOKEN-RING
COMMPROCESSOR AND PHYSICAL-LAYER INTERFACE
SPWS016A – NOVEMBER 1994 – REVISED JULY 1995
memory-bus timing: read cycle
tM is the cycle time of one-eighth of a local-memory cycle (31.25 ns minimum for a 4-MHz local bus or
20.83 ns minimum for a 6-MHz local bus).
NO.
MIN
MAX
UNIT
32 Access time, address / enable valid on MAX0, MAX2, and MROMEN to valid data / parity
33
Access time, address valid on MAXPH, MAXPL, MADH0 – MADH7, and MADL0 – MADL7 to
valid data / parity
6tM – 23 ns
6tM – 23
ns
35 Access time, MRAS low to valid data / parity
36 Hold time, valid data / parity after MRAS no longer low
4.5tM – 21.5 ns
0
ns
37†
Hold time, address in the high-impedance state on MAXPH, MAXPL, MADH0 – MADH7 and
MADL0 – MADL7 after MRAS high (see Note 22)
2tM – 10.5
ns
38 Access time, MCAS low to valid data / parity
39 Hold time, valid data / parity after MCAS no longer low
3tM –23 ns
0
ns
40†
Hold time, address in the high-impedance state on MAXPH, MAXPL, MADH0 – MADH7, and
MADL0 – MADL7 after MCAS high (see Note 22)
2tM –13
ns
41 Delay time, MCAS no longer high to MOE low
42†
Setup time, address / status in the high-impedance state on MAXPH, MAXPL,
MADL0 – MADL7, and MADH0 – MADH7 before MOE no longer high
tM +13 ns
0
ns
43 Access time, MOE low to valid data / parity
44 Pulse duration, MOE low
45 Delay time, MCAS low to MOE no longer low
46 Hold time, valid data / parity in after MOE no longer low
2tM – 9
3tM – 9
0
2tM – 20 ns
ns
ns
ns
47†
Hold time, address in the high-impedance state on MAXPH, MAXPL, MADH0 – MADH7, and
MADL0 – MADL7 after MOE high (see Note 22)
2tM – 15
ns
48†
Setup time, address / status in the high-impedance state on MAXPH, MAXPL,
MADL0 – MADL7, and MADH0 – MADH7, before MBEN no longer high
0
ns
48a†
Setup time, address / status in the high-impedance state on MAXPH, MAXPL,
MADL0 – MADL7, and MADH0 – MADH7 and before MBIAEN no longer high
0
ns
49 Access time, MBEN low to valid data / parity
49a Access time, MBIAEN low to valid data / parity
50 Pulse duration, MBEN low
50a Pulse duration, MBIAEN low
51 Hold time, valid data / parity after MBEN no longer low
2tM – 9
2tM – 9
0
2tM – 25 ns
2tM – 25 ns
ns
ns
ns
51a Hold time, valid data / parity after MBIAEN no longer low
0
ns
52†
Hold time, address in the high-impedance state on MAXPH, MAXPL, MADH0 – MADH7, and
MADL0 – MADL7 after MBEN high (see Note 22)
2tM – 15
ns
52a†
Hold time, address in the high-impedance state on MAXPH, MAXPL, MADH0 – MADH7, and
MADL0 – MADL7 after MBIAEN high
2tM – 15
ns
53 Hold time, MDDIR high after MBEN high, read follows write cycle
1.5tM – 12
ns
54 Setup time, MDDIR low before MBEN no longer high
3tM – 5
ns
55 Hold time, MDDIR low after MBEN high, write follows read cycle
3tM – 12
ns
† This specification has been characterized to meet stated value. It is not assured during manufacturing testing.
NOTE 22: The data / parity that exists on the address lines will most likely reach the high-impedance state sometime later than the rising edge
of MRAS, MCAS, MOE, or MBEN (between MIN and MAX of timing parameter 36) and will be a function of the memory being read.
The MIN time given represents the time from the rising edge of MRAS, MCAS, MOE, or MBEN to the beginning of the next address,
and does not represent the actual high-impedance period on the address bus.
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