PIC24FJ128GA Datasheet, PDF (218/232 Pages) Microchip Technology – General Purpose, 16-Bit Flash Microcontrollers

PIC24FJ128GA FAMILY
100-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads = n1
p
D1 D
2
1
B
n
CH x 45
α
c
A
β
φ
A1
L
F
A2
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
100
p
.016 BSC
100
0.40 BSC
Pins per Side
n1
25
25
Overall Height
A
.039
.043
.047
1.00
1.10
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
A1
.002
.004
.006
0.05
0.10
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Footprint (Reference)
Foot Angle
F
.039 REF.
1.00 REF.
φ
0°
3.5°
7°
0°
3.5°
7°
Overall Width
E
.551 BSC
14.00 BSC
Overall Length
D
.551 BSC
14.00 BSC
Molded Package Width
E1
.472 BSC
12.00 BSC
Molded Package Length
Lead Thickness
D1
.472 BSC
12.00 BSC
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.005
.007
.009
0.13
0.18
0.23
Mold Draft Angle Top
α
5°
10°
15°
5°
10°
15°
Mold Draft Angle Bottom
β
5°
10°
15°
5°
10°
15°
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.10" (0.254 mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MS-026
Drawing No. C04-100
Revised 07-22-05
DS39747C-page 216
Preliminary
© 2006 Microchip Technology Inc.