TC290 Datasheet, PDF (455/476 Pages) Infineon Technologies AG – 32-Bit Single-Chip Micocontroller

TC290 / TC297 / TC298 / TC299 BB-Step
Electrical SpecificationPackage Outline
25 ±0.1
CODE
INDEX MARKING
(LASERED )
d 0.1 2 x
B
2x
d 0.1
5 16x
0.15
COPLANARITY
1.7 MAX
29 x 0.8 = 23.2
0.1 C
0.5 ±0.05
516 x
0 .8
0 .1 5 M C A B
0.08 M C
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
AJ AG AE AC AA Y W V U T R P N M L K J H G F E D C B A
AK AH AF AD AB
0.8
0.8
INDEX
MARKING
0 ,3 MIN
STAND OFF
Figure 3-37 Package Outlines PG-LFBGA-516-5
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3.35.1 Package Parameters
Table 3-108 Thermal Characteristics of the Package
Device
Package
RQJCT¹⁾ RQJCB¹⁾ RQJA
Unit
Note
TC297
LF-BGA-292-6
3,0
4,3
15,1
K/W
TC298
PG-BGA-416-26
2,9
5,4
12,8
K/W
TC299
PG-LFBGA-516-5
2,8
4,3
15,1
K/W
1) The top and bottom thermal resistances between the case and the ambient (R_TCAT, R_TCAB) are to be combined with the
thermal resistances between the junction and the case given above (R_TJCT, R_TJCB), in order to calculate the total thermal
resistance between the junction and the ambient (R_TJA). The thermal resistances between the case and the ambient (R_TCAT,
R_TCAB) depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation: T_J = T_A + R_TJA * P_D, where the R_TJA is the total
thermal resistance between the junction and the ambient. This total junction ambient resistance R_TJA can be obtained from
the upper four partial thermal resistances.
Thermal resistances as measured by the ’cold plate method’ (MIL SPEC-883 Method 1012.1).
3.35.2 TC290 Carrier Tape
Data Sheet
3-449
V 1.1 2015-05
TC290/TC297/TC298/TC299 BB-Step Data Sheet downloaded by saravanakumar maniyam (larsen and Toubro limited) at 08 Sep 2015 08:06