TC290 Datasheet, PDF (300/476 Pages) Infineon Technologies AG – 32-Bit Single-Chip Micocontroller

TC290 / TC297 / TC298 / TC299 BB-Step
Package and Pinning DefinitionsTC29x Bare Die Pad Definition
Table 2-74 TC29x Bare Die Pad List (cont’d)
Number Pad Name
Pad Type
X
43
P13.1
LVDSM_P / PU1 -940000
/ VEXT
44
VEXT
Vx
-865000
45
P13.2
LVDSM_N / PU1 -790000
/ VEXT
46
P13.3
LVDSM_P / PU1 -460000
/ VEXT
47
VSS
Vx
-385000
48
P13.4
LVDSM_N / PU1 -310000
/ VEXT
49
P13.5
LVDSM_P / PU1 20000
/ VEXT
50
VEXT
Vx
95000
51
P13.6
LVDSM_N / PU1 170000
/ VEXT
52
P13.7
LVDSM_P / PU1 500000
/ VEXT
53
P13.11
LP / PU1 / VEXT 580000
54
P13.12
LP / PU1 / VEXT 640000
55
VDDP3
Vx
697500
56
VDDP3
Vx
765000
57
VEXT
Vx
830000
58
VEXT
Vx
880000
59
VDD
Vx
955000
60
VSS
Vx
1055000
61
P13.13
LP / PU1 / VEXT 1135000
62
P13.9
MP / PU1 / VEXT 1205000
63
P13.14
LP / PU1 / VEXT 1275000
64
VEXT
Vx
1330000
65
P13.10
LP / PU1 / VEXT 1385000
66
VDDFL3
Vx
1455000
67
VSS
Vx
1575000
68
VDDFL3
Vx
1542500
69
P13.15
LP / PU1 / VEXT 1660000
70
P12.0
LP / PU1 /
VFLEX
1790000
71
P12.1
LP / PU1 /
VFLEX
1850000
Y
-4186500
-4295000
-4186500
-4186500
-4295000
-4186500
-4186500
-4295000
-4186500
-4186500
-4295000
-4186500
-4295000
-4186500
-4295000
-4186500
-4295000
-4295000
-4186500
-4295000
-4186500
-4295000
-4186500
-4295000
-4295000
-4186500
-4186500
-4186500
-4295000
Comment
GPIO
Must be bonded to VEXT
GPIO
GPIO
Must be bonded to VSS
GPIO
GPIO
Must be bonded to VEXT
GPIO
GPIO
GPIO
GPIO
Must be bonded to VDDP3
Must be bonded to VDDP3
Must be bonded to VEXT
Must be bonded to VEXT
Must be bonded to VDD
Must be bonded to VSS
GPIO
GPIO
GPIO
Must be bonded to VEXT
GPIO
Must be bonded to VDDP3
Must be bonded to VSS
(Double Pad / Center of
Elephant Pad Opening)
Must be bonded to VDDP3
GPIO
GPIO
GPIO
Data Sheet
2-294
V 1.1 2015-05
TC290/TC297/TC298/TC299 BB-Step Data Sheet downloaded by saravanakumar maniyam (larsen and Toubro limited) at 08 Sep 2015 08:06