TC290 Datasheet, PDF (309/476 Pages) Infineon Technologies AG – 32-Bit Single-Chip Micocontroller

TC290 / TC297 / TC298 / TC299 BB-Step
Package and Pinning DefinitionsTC29x Bare Die Pad Definition
Table 2-74 TC29x Bare Die Pad List (cont’d)
Number Pad Name
Pad Type
X
288
P33.4
LP / PU1 / VEXT 1325000
289
P34.3
LP / PU1 / VEXT 1265000
290
P33.5
LP / PU1 / VEXT 1205000
291
P34.4
LP / PU1 / VEXT 1145000
292
P33.6
LP / PU1 / VEXT 1085000
293
P34.5
LP / PU1 / VEXT 1015000
294
P33.7
LP / PU1 / VEXT 955000
295
P33.8
MP / HighZ /
VEXT
885000
296
P33.9
LP / PU1 / VEXT 815000
297
VSS
Vx
760000
298
P33.10
MP / PU1 / VEXT 695000
299
P33.14
LP / PU1 / VEXT 625000
300
P33.11
MP / PU1 / VEXT 555000
301
P33.15
LP / PU1 / VEXT 485000
302
P33.12
MP / PU1 / VEXT 415000
303
P32.5
LP / PU1 / VEXT 345000
304
P33.13
MP / PU1 / VEXT 275000
305
P32.6
LP / PU1 / VEXT 205000
306
VGATE3P (LDO) VGATE3P
150000
307
VEXT
Vx
96000
308
P32.0
LP / EVR13
SMPS -> PD,
GPIO -> PU1 /
VEXT
37000
309
VGATE1N
VGATE1N
-18000
(SMPS)
310
VGATE1P
VGATE1P
-68000
(SMPS)
311
VGATE1P (LDO) VGATE1P
-118000
312
P32.2
LP / PU1 / VEXT -173000
313
VSS
Vx
-268000
314
VDD
Vx
-368000
315
P32.3
LP / PU1 / VEXT -463000
316
P32.7
LP / PU1 / VEXT -523000
Y
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4295000
4186500
4295000
Comment
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
Must be bonded to VSS
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
Must be bonded to VSS
Must be bonded to VEXT
GPIO
Must be bonded to VSS if
EVR13 SMPS is not used.
Must be bonded to NMOS
gate if EVR13 SMPS is
used.
Must be bonded to VEXT if
EVR13 SMPS is not used.
Must be bonded to PMOS
gate if EVR13 SMPS is
used.
VGATE1P (LDO)
GPIO
Must be bonded to VSS
Must be bonded to VDD
GPIO
GPIO
Data Sheet
2-303
V 1.1 2015-05
TC290/TC297/TC298/TC299 BB-Step Data Sheet downloaded by saravanakumar maniyam (larsen and Toubro limited) at 08 Sep 2015 08:06