TC290 Datasheet, PDF (299/476 Pages) Infineon Technologies AG – 32-Bit Single-Chip Micocontroller

TC290 / TC297 / TC298 / TC299 BB-Step
Package and Pinning DefinitionsTC29x Bare Die Pad Definition
Table 2-74 TC29x Bare Die Pad List (cont’d)
Number Pad Name
Pad Type
X
13
P15.5
MP / PU1 / VEXT -3523000
14
P15.6
MP / PU1 / VEXT -3283000
15
P15.7
MP / PU1 / VEXT -3363000
16
P15.8
MP / PU1 / VEXT -3153000
17
VEXT
Vx
-3218000
18
P14.1
MP / PU1 / VEXT -3073000
19
P14.0
MP+ / PU1 /
VEXT
-2983000
20
P14.3
LP / PU1 / VEXT -2843000
21
P14.2
LP / PU1 / VEXT -2903000
22
P14.4
LP / PU1 / VEXT -2733000
23
VSS
Vx
-2788000
24
VDD
Vx
-2674000
25
VSS
Vx
-2574000
26
VDDFL3
Vx
-2505000
27
P14.11
LP / PU1 / VEXT -2380000
28
VDDFL3
Vx
-2437500
29
P14.5
MP+ / PU1 /
VEXT
-2300000
30
P14.12
LP / PU1 / VEXT -2220000
31
P14.6
MP+ / PU1 /
VEXT
-2140000
32
P14.13
MP+ / PU1 /
-2040000
VEXT
33
P14.7
LP / PU1 / VEXT -1960000
34
P14.14
MP+ / PU1 /
-1880000
VEXT
35
VEXT
Vx
-1805000
36
P14.8
LP / PU1 / VEXT -1750000
37
P14.9
MP+ / PU1 /
VEXT
-1670000
38
P14.15
LP / PU1 / VEXT -1590000
39
P14.10
MP+ / PU1 /
-1510000
VEXT
40
VDDFL3
Vx
-1410000
41
VSS
Vx
-1345000
42
P13.0
LVDSM_N / PU1 -1270000
/ VEXT
Y
-4295000
-4186500
-4295000
-4186500
-4295000
-4295000
-4186500
-4186500
-4295000
-4186500
-4295000
-4295000
-4295000
-4186500
-4186500
-4295000
-4295000
-4186500
-4295000
-4186500
-4295000
-4186500
-4295000
-4186500
-4295000
-4186500
-4295000
-4186500
-4295000
-4186500
Comment
GPIO
GPIO
GPIO
GPIO
Must be bonded to VEXT
GPIO
GPIO
GPIO
Must be bonded to VEXT if
EVR13 active. Must be
bonded to VSS if EVR13
inactive.
GPIO
Must be bonded to VSS
Must be bonded to VDD
Must be bonded to VSS
Must be bonded to VDDP3
GPIO
Must be bonded to VDDP3
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
Must be bonded to VEXT
GPIO
GPIO
GPIO
GPIO
Must be bonded to VDDP3
Must be bonded to VSS
GPIO
Data Sheet
2-293
V 1.1 2015-05
TC290/TC297/TC298/TC299 BB-Step Data Sheet downloaded by saravanakumar maniyam (larsen and Toubro limited) at 08 Sep 2015 08:06