TC290 Datasheet, PDF (311/476 Pages) Infineon Technologies AG – 32-Bit Single-Chip Micocontroller

TC290 / TC297 / TC298 / TC299 BB-Step
Package and Pinning DefinitionsTC29x Bare Die Pad Definition
Table 2-74 TC29x Bare Die Pad List (cont’d)
Number Pad Name
Pad Type
340
P30.0
MP / PU1 /
VFLEXE
341
P30.1
MP / PU1 /
VFLEXE
342
P30.2
MP / PU1 /
VFLEXE
343
VFLEXE
Vx
X
-2483000
-2563000
-2643000
-2788000
344
P30.3
MP / PU1 /
VFLEXE
-2723000
345
VSS
Vx
-2918000
346
P30.4
MP / PU1 /
VFLEXE
-2853000
347
P30.5
MP / PU1 /
VFLEXE
-2983000
348
P30.6
MP / PU1 /
VFLEXE
-3063000
349
P30.8
MP / PU1 /
VFLEXE
-3223000
350
P30.7
MP / PU1 /
VFLEXE
-3143000
351
VFLEXE
Vx
-3368000
352
P30.9
353
P30.11
354
P30.10
355
P30.15
356
P30.12
357
VSS
358
P30.13
359
P26.0
360
P30.14
361
VSS
MP / PU1 /
VFLEXE
MP / PU1 /
VFLEXE
MP / PU1 /
VFLEXE
MP / PU1 /
VFLEXE
MP / PU1 /
VFLEXE
Vx
MP / PU1 /
VFLEXE
LP / PU1 /
VFLEXE
MP / PU1 /
VFLEXE
Vx
-3303000
-3513000
-3433000
-3673000
-3593000
-3818000
-3753000
-3953000
-3883000
-4098000
Y
4295000
4186500
4295000
4295000
4186500
4295000
4186500
4186500
4295000
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
4186500
4295000
Comment
GPIO
GPIO
GPIO
Must be bonded to VEXT or
VDDP3
GPIO
Must be bonded to VSS
GPIO
GPIO
GPIO
GPIO
GPIO
Must be bonded to VEXT or
VDDP3
GPIO
GPIO
GPIO
GPIO
GPIO
Must be bonded to VSS
GPIO
GPIO
GPIO
Must be bonded to VSS
(Double Pad / Center of
Elephant Pad Opening)
Data Sheet
2-305
V 1.1 2015-05
TC290/TC297/TC298/TC299 BB-Step Data Sheet downloaded by saravanakumar maniyam (larsen and Toubro limited) at 08 Sep 2015 08:06