TC290 Datasheet, PDF (314/476 Pages) Infineon Technologies AG – 32-Bit Single-Chip Micocontroller

TC290 / TC297 / TC298 / TC299 BB-Step
Package and Pinning DefinitionsTC29x Bare Die Pad Definition
Table 2-74 TC29x Bare Die Pad List (cont’d)
Number Pad Name
Pad Type
X
431
P22.8
LP / PU1 / VEXT -4419500
432
P22.9
LP / PU1 / VEXT -4528000
433
P22.10
LP / PU1 / VEXT -4419500
434
P22.11
LP / PU1 / VEXT -4528000
435
VDDOSC
Vx
-4528000
436
VSSOSC
Vx
-4528000
437
XTAL1
XTAL1
-4419500
438
XTAL2
XTAL2
-4419500
439
VSSOSC
Vx
-4528000
440
VDDOSC3
Vx
-4419500
441
VDDP3
Vx
-4528000
442
P21.0
LVDSH_N / PU1 -4419500
/ VDDP3
443
P21.1
LVDSH_P / PU1 -4419500
/ VDDP3
444
VSSP
Vx
-4528000
445
P21.2
LVDSH_N / PU1 -4419500
/ VDDP3
446
P21.3
LVDSH_P / PU1 -4419500
/ VDDP3
447
VDDP3
Vx
-4528000
448
P21.4
LVDSH_N / PU1 -4419500
/ VDDP3
449
VSS
Vx
-4528000
450
P21.5
LVDSH_P / PU1 -4419500
/ VDDP3
451
VDD
Vx
-4528000
452
VSSP
Vx
-4528000
453
P21.6
A2 / PU / VDDP3 -4419500
454
VDDP3
Vx
-4528000
455
TMS /DAP1
A2 / PD / VDDP3 -4419500
Y
-387000
-447000
-507000
-567000
-702000
-802000
-909500
-1009500
-1117000
-1167000
-1257000
-1362500
-1462500
-1525000
-1587500
-1687500
-1750000
-1824500
-2020000
-1975500
-2150000
-2260000
-2210000
-2360000
-2310000
Comment
GPIO
GPIO
GPIO
GPIO
Must be bonded to VSS
Must be bonded to VSS
Main Oscillator/PLL/Clock
Generator Input. Must be
bonded to external quartz
or resonator.
Main Oscillator/PLL/Clock
Generator Input. Must be
bonded to external quartz
or resonator.
Must be bonded to VSS
Must be bonded to VDDP3
Must be bonded to VDDP3
GPIO
GPIO
Must be bonded to VSS
GPIO
GPIO
Must be bonded to VDDP3
GPIO
Must be bonded to VSS
(Double Pad / Center of
Elephant Pad Opening)
GPIO
Must be bonded to VDD
Must be bonded to VSS
GPIO, TDI
Must be bonded to VDDP3
JTAG Module State
Machine Control Input /
Device Access Port Line 1
Data Sheet
2-308
V 1.1 2015-05
TC290/TC297/TC298/TC299 BB-Step Data Sheet downloaded by saravanakumar maniyam (larsen and Toubro limited) at 08 Sep 2015 08:06