PIC16F193X Datasheet, PDF (370/418 Pages) Microchip Technology – 28/40/44-Pin Flash-Based, 8-Bit CMOS Microcontrollers with LCD Driver and nanoWatt Technology

PIC16F193X/LF193X
28.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
θJA Thermal Resistance Junction to Ambient
60
°C/W 28-pin SPDIP package
80
°C/W 28-pin SOIC package
90
°C/W 28-pin SSOP package
27.5
°C/W 28-pin QFN 6x6mm package
47.2
°C/W 40-pin PDIP package
46
°C/W 44-pin TQFP package
24.4
°C/W 44-pin QFN 8x8mm package
TH02
θJC Thermal Resistance Junction to Case
31.4
°C/W 28-pin SPDIP package
24
°C/W 28-pin SOIC package
24
°C/W 28-pin SSOP package
24
°C/W 28-pin QFN 6x6mm package
24.7
°C/W 40-pin PDIP package
14.5
°C/W 44-pin TQFP package
20
°C/W 44-pin QFN 8x8mm package
TH03
TJMAX Maximum Junction Temperature
150
°C
TH04
TH05
PD Power Dissipation
PINTERNAL Internal Power Dissipation
—
W
PD = PINTERNAL + PI/O
—
W
PINTERNAL = IDD x VDD⁽¹⁾
TH06
TH07
PI/O
PDER
I/O Power Dissipation
Derated Power
—
W
PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
—
W
PDER = PDMAX (TJ - TA)/θJA⁽²⁾
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature
DS41364A-page 368
Preliminary
© 2008 Microchip Technology Inc.