MC908JB16DWE Datasheet, PDF (326/332 Pages) Freescale Semiconductor, Inc – Microcontrollers

Mechanical Specifications
21.3 32-Pin Low-Profile Quad Flat Pack (LQFP)
A
A1
32
4X
0.20 (0.008) AB T–U Z
25
1
–T–
B
B1
8
DETAIL Y
–U–
V
17 ^V1
9
–Z–
4X
9
S1
0.20 (0.008) AC T–U Z
S
–AB–
SEATING
PLANE
–AC–
G
0.10 (0.004) AC
8X M_
R
CE
DETAIL AD
BASE
METAL
F^{ÉÉÉÉÉÉÉÉ}_JN D
SECTION AE–AE
W
H
K ^Q_
X
DETAIL AD
AE
P
AE
DETAIL Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 7.000 BSC
0.276 BSC
A1 3.500 BSC
0.138 BSC
B 7.000 BSC
0.276 BSC
B1 3.500 BSC
0.138 BSC
C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018
E 1.350 1.450 0.053 0.057
F 0.300 0.400 0.012 0.016
G 0.800 BSC
0.031 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M
12_ REF
12_ REF
N 0.090 0.160 0.004 0.006
P 0.400 BSC
0.016 BSC
Q
1_
5_ 1_
5_
R 0.150 0.250 0.006 0.010
S 9.000 BSC
0.354 BSC
S1 4.500 BSC
0.177 BSC
V 9.000 BSC
0.354 BSC
V1 4.500 BSC
0.177 BSC
W 0.200 REF
0.008 REF
X 1.000 REF
0.039 REF
Figure 21-1. 32-Pin LQFP (Case #873A)
Technical Data
326
Mechanical Specifications
MC68HC908JB16 — Rev. 1.1
Freescale Semiconductor