XQ2V1000 Datasheet, PDF (5/127 Pages) Xilinx, Inc – QPro Virtex-II 1.5V Military QML Platform FPGAs

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QPro Virtex-II 1.5V Military QML Platform FPGAs
Virtex-II Device/Package Combinations and Maximum I/O
Wire-bond and flip-chip packages are available. Table 4
shows the maximum possible number of user I/Os in
wire-bond and flip-chip packages. Table 5 shows the num-
ber of available user I/Os for all device/package combina-
tions.
• FG denotes wire-bond fine-pitch Plastic BGA (1.00 mm
pitch).
• BG denotes wire-bond standard Plastic BGA (1.27 mm
pitch).
• CG denotes wire-bond fine-pitch Hermetic Ceramic
Column Grid Array (1.27 mm pitch).
• CF denotes flip-chip fine-pitch non-Hermetic Ceramic
Column Grid Array (1.00 mm pitch).
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, and RSVD) and VBATT.
Table 4: Package Information
Package
Pitch (mm)
Size (mm)
FG456
1.00
23 x 23
BG575
1.27
31 x 31
BG728 & CG717
1.27
35 x 35
CF1144
1.00
35 x 35
Table 5: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os
Available I/Os
Package
XQ2V1000
XQ2V3000
FG456
324
-
BG575
328
-
BG728
-
516
CG717
-
516
CF1144
-
-
Notes:
1. The BG728 and CG717 packages are pinout (footprint) compatible.
2. The CF1144 is pinout (footprint) compatible with the FF1152.
XQ2V6000
-
-
-
-
824
DS122 (v1.1) January 7, 2004
www.xilinx.com
5
Product Specification
1-800-255-7778