XQ2V1000 Datasheet, PDF (109/127 Pages) Xilinx, Inc – QPro Virtex-II 1.5V Military QML Platform FPGAs

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QPro Virtex-II 1.5V Military QML Platform FPGAs
CF1144 Ceramic Flip-Chip Fine-Pitch CGA Package
As shown in Table 80, The XQ2V6000 QPro Virtex-II device
is available in the CF1144 flip-chip fine-pitch CGA package.
Pins for this package are the same as the FF1152, except
for those pins shown in Table 79 have been removed. Fol-
lowing this table are the CF1144 Ceramic Flip-Chip
Fine-Pitch CGA Package Specifications (1.00mm pitch).
The CF1144 has eight fewer GND pins than the FF1152.
The FF1152 GND Pin numbers missing on the CF1144 are
shown in Table 79.
Table 79: FF1152 GND Pins not available on the
CF1144
FF1152 GND Pin Numbers
A2
A33
AN1
AN34
B1
B34
AP2
AP33
1. Physical pin does not exist for CF1144 package
Table 80: CF1144 CGA — XQ2V6000
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L01N_0
IO_L01P_0
IO_L02N_0
IO_L02P_0
IO_L03N_0/VRP_0
IO_L03P_0/VRN_0
IO_L04N_0/VREF_0
IO_L04P_0
IO_L05N_0
IO_L05P_0
IO_L06N_0
IO_L06P_0
IO_L19N_0
IO_L19P_0
IO_L20N_0
IO_L20P_0
IO_L21N_0
IO_L21P_0/VREF_0
IO_L22N_0
IO_L22P_0
IO_L23N_0
IO_L23P_0
IO_L24N_0
IO_L24P_0
IO_L25N_0
IO_L25P_0
Pin
Number
D29
C29
H26
G26
E28
E27
F25
F26
H25
H24
E26
F27
B32
C33
J24
J23
C27
C28
B30
B31
K23
K22
C26
D27
A30
A31
Table 80: CF1144 CGA — XQ2V6000
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L26N_0
IO_L26P_0
IO_L27N_0
IO_L27P_0/VREF_0
IO_L28N_0
IO_L28P_0
IO_L29N_0
IO_L29P_0
IO_L30N_0
IO_L30P_0
IO_L49N_0
IO_L49P_0
IO_L50N_0
IO_L50P_0
IO_L51N_0
IO_L51P_0/VREF_0
IO_L52N_0
IO_L52P_0
IO_L53N_0
IO_L53P_0
IO_L54N_0
IO_L54P_0
IO_L60N_0
IO_L60P_0
IO_L67N_0
IO_L67P_0
Pin
Number
G24
G25
E25
E24
D25
D26
H23
H22
F23
F24
B28
B29
J22
J21
A28
A29
A26
B27
C24
D24
D22
D23
B25
B26
B23
B24
DS122 (v1.1) January 7, 2004
www.xilinx.com
109
Product Specification
1-800-255-7778