K524G2GACB-A050 Datasheet, PDF (2/94 Pages) Samsung semiconductor – MCP MEMORY

K524G2GACB-A050
Document Title
Multi-Chip Package MEMORY
4Gb (256M x16) NAND Flash Memory / 2Gb (64M x32) Mobile DDR SDRAM
1. Revision History
Revision No.
History
0.0
Initial issue.
- 4Gb NAND Flash W-die_ Ver 0.0
- 2Gb M-DDR SDRAM B-die_Ver 1.0
1.0
<NAND>_Ver 1.0
- Corrected Errata
- ECC requirement updated
- Final issue
<DRAM>_Ver 1.2
Ver 1.1
- Corrected errata.
Ver 1.2
- Finalized.
<Common>
- Finalized
<NAND>_Ver 1.01
1.1
1. ECC requirement updated
MCP MEMORY
Draft Date
May. 8, 2009
Remark
Preliminary
Aug. 17, 2009
Final
Sep. 03, 2009
Final
1.2
<NAND>_Ver 1.1
1. ECC requirement updated
2. Chapter 3.10 : Updated note for Random data input
<M-DDR>_Ver 1.3
1.3
<Common>
- Added DDR333.
Oct. 8, 2009
Final
Nov. 26, 2009
Final
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s web site.
http://samsungelectronics.com/semiconductors/products/products_index.html
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to
change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any ques-
tions, please contact the SAMSUNG branch office near you.
-2-
Revision 1.3
November 2009