RG82845SL5YQ Datasheet, PDF (134/148 Pages) Intel Corporation – Intel® 845 Chipset: 82845 Memory Controller Hub (MCH) for SDR

Ballout and Package Information
R
7.1
Package Mechanical Information
This section provides the MCH package mechanical dimensions. The package is a 593 ball
FC-BGA.
Figure 8. Intel^® MCH FC-BGA Package Dimensions (Top and Side View)
Top View
37.50
33.90
16.95
16.95
33.90
37.50
134
9.67
0.600 ±0.100
Substrate
36.28
Side View
Die
See Detail A
Units = M illim eters
Detail A
0.74 ±0.025
Underfill
Epoxy
0.10 ±0.025 ^{Die Solder}
Bum ps
0.61
1.100 ±0.100
A
0.152
pkg_olga_593_top-side
Intel^® 82845 MCH for SDR Datasheet